Modified thermosonic flip-chip bonding based on electroplated Cu microbumps and concave pads for high-precision low-temperature assembly applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2013, Pages 425-430

  Bui, Tung Thanh ^a   Suzuki, Motohiro ^a   Kato, Fumiki ^a   Watanabe, Naoya ^a   Nemoto, Shunsuke ^a   Kikuchi, Katsuya ^a   Aoyagi, Masahiro ^a  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING PADS; EXPERIMENTAL VALIDATIONS; HIGH-PRECISION; INTEGRATION APPLICATION; LOW TEMPERATURE BONDING; LOW TEMPERATURES; MICRO-BUMPS; THERMOSONIC FLIP-CHIP BONDING;

BONDING; TEMPERATURE;

FLIP CHIP DEVICES;

EID: 84883351384     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2013.6575606     Document Type: Conference Paper

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