Self-assembly technologies with high-precision chip alignment and fine-pitch microbump bonding for advanced die-to-wafer 3D integration

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 2050-2055

  Fukushima, T ^a   Ohara, Y ^a   Murugesan, M ^a   Bea, J C ^a   Lee, K W ^a   Tanaka, T ^a   Koyanagi, M ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; 3D STACKING; ALIGNMENT ACCURACY; CHIP ALIGNMENT; FLIP CHIP; HIGH-PRECISION; HYDROPHILIC AND HYDROPHOBIC; HYDROPHILIC BONDING; KEY PARAMETERS; KNOWN-GOOD DIES; MECHANICAL ALIGNMENT; MICRO-BUMPS; RESULTING RESISTANCE; SELF-ASSEMBLED; SELF-ASSEMBLY TECHNIQUE; SELF-ASSEMBLY TECHNOLOGY; SILICON SUBSTRATES; SMALL DROPLETS; THERMAL COMPRESSIONS; ULTRA-PURE WATER; WATER CONTACT ANGLE;

ALIGNMENT; CONTACT ANGLE; DIES; DROP FORMATION; HYDROPHILICITY; HYDROPHOBICITY; SELF ASSEMBLY; SILICON WAFERS; THREE DIMENSIONAL; WAFER BONDING;

BONDING;

EID: 79960414240     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898799     Document Type: Conference Paper

References (13)

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