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Japanese Journal of Applied Physics

Volumn 51, Issue 4 PART 2, 2012, Pages

Room-temperature microjoining of LSI chips on poly(ethylene naphthalate) film using mechanical caulking of Au cone bump

(4) Shuto, Takanori a Watanabe, Naoya a,b Ikeda, Akihiro a Asano, Tanemasa a

a KYUSHU UNIVERSITY (Japan)

b NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AU BUMP; AU CONE; CONE-SHAPED; COUNTER ELECTRODES; LAYERED STRUCTURES; LSI CHIPS; MICRO-JOINING; PEN FILM; POLYETHYLENE NAPHTHALATE; ROOM TEMPERATURE; SI WAFER;

BONDING; ELECTROLESS PLATING; ETHYLENE; GOLD COATINGS; PHOTOLITHOGRAPHY; SILICON WAFERS;

GOLD;

EID: 84860377529 PISSN: 00214922 EISSN: 13474065 Source Type: Journal
DOI: 10.1143/JJAP.51.04DB04 Document Type: Article

Times cited : (6)

References (22)

1
- 67650483313
- J.-S. Park, T.-W. Kim, D. Stryakhilev, J.-S. Lee, S.-G. An, Y.-S. Pyo, D.-B. Lee, Y. G. Mo, D.-U. Jin, and H. K. Chung: Appl. Phys. Lett. 95 (2009) 013503.
- (2009) Appl. Phys. Lett. , vol.95 , pp. 013503
- Park, J.-S.¹ Kim, T.-W.² Stryakhilev, D.³ Lee, J.-S.⁴ An, S.-G.⁵ Pyo, Y.-S.⁶ Lee, D.-B.⁷ Mo, Y.G.⁸ Jin, D.-U.⁹ Chung, H.K.¹⁰

2
- 33644525617
- L. Zhou, A. Wanga, S.-C. Wu, J. Sun, S. Park, and T. N. Jackson: Appl. Phys. Lett. 88 (2006) 083502.
- (2006) Appl. Phys. Lett. , vol.88 , pp. 083502
- Zhou, L.¹ Wanga, A.² Wu, S.-C.³ Sun, J.⁴ Park, S.⁵ Jackson, T.N.⁶

3
- 24644507142
- T. Someya, Y. Kato, T. Sekitani, S. Iba, Y. Noguchi, Y. Murase, H. Kawaguchi, and T. Sakurai: Proc. Natl. Acad. Sci. U.S.A. 102 (2005) 12321.
- (2005) Proc. Natl. Acad. Sci. U.S.A. , vol.102 , pp. 12321
- Someya, T.¹ Kato, Y.² Sekitani, T.³ Iba, S.⁴ Noguchi, Y.⁵ Murase, Y.⁶ Kawaguchi, H.⁷ Sakurai, T.⁸

4
- 78649976514
- T. Sekitani, U. Zschieschang, H. Klauk, and T. Someya: Nat. Mater. 9 (2010) 1015.
- (2010) Nat. Mater. , vol.9 , pp. 1015
- Sekitani, T.¹ Zschieschang, U.² Klauk, H.³ Someya, T.⁴

5
- 70249132896
- A. Jedaa and M. Halik: Appl. Phys. Lett. 95 (2009) 103309.
- (2009) Appl. Phys. Lett. , vol.95 , pp. 103309
- Jedaa, A.¹ Halik, M.²

6
- 9744248669
- K. Nomura, H. Ohta, A. Takagi, T. Kamiya, M. Hirano, and H. Hosono: Nature 432 (2004) 488.
- (2004) Nature , vol.432 , pp. 488
- Nomura, K.¹ Ohta, H.² Takagi, A.³ Kamiya, T.⁴ Hirano, M.⁵ Hosono, H.⁶

7
- 0347590774
- K. Tanida, M. Umemoto, T. Morifuji, R. Kajiwara, T. Ando, Y. Tomita, N. Tanaka, and K. Takahashi: Jpn. J. Appl. Phys. 42 (2003) 6390.
- (2003) Jpn. J. Appl. Phys. , vol.42 , pp. 6390
- Tanida, K.¹ Umemoto, M.² Morifuji, T.³ Kajiwara, R.⁴ Ando, T.⁵ Tomita, Y.⁶ Tanaka, N.⁷ Takahashi, K.⁸

8
- 31644434548
- J. W. Nah, F. Ren, K. N. Tu, S. Venk, and G. Camara: J. Appl. Phys. 99 (2006) 023520.
- (2006) J. Appl. Phys. , vol.99 , pp. 023520
- Nah, J.W.¹ Ren, F.² Tu, K.N.³ Venk, S.⁴ Camara, G.⁵

9
- 0942287637
- B. Pahl, C. Kallmayer, R. Aschenbrenner, and H. Reichl: MicroElectron. Reliab. 44 (2004) 309.
- (2004) MicroElectron. Reliab. , vol.44 , pp. 309
- Pahl, B.¹ Kallmayer, C.² Aschenbrenner, R.³ Reichl, H.⁴

10
- 48349090664
- K.-W. Jang, C.-K. Chung, W.-S. Lee, and K.-W. Paik: MicroElectron. Reliab. 48 (2008) 1052.
- (2008) MicroElectron. Reliab. , vol.48 , pp. 1052
- Jang, K.-W.¹ Chung, C.-K.² Lee, W.-S.³ Paik, K.-W.⁴

11
- 58149100774
- J. Govaerts and J. Vanfleteren: Proc. 2nd Electronics Systemintegration Technology Conf., 2008, p. 309.
- (2008) Proc. 2nd Electronics Systemintegration Technology Conf. , pp. 309
- Govaerts, J.¹ Vanfleteren, J.²

12
- 44149110620
- M.-C. Choi, Y. Kim, and C.-S. Ha: Prog. Polym. Sci. 33 (2008) 581.
- (2008) Prog. Polym. Sci. , vol.33 , pp. 581
- Choi, M.-C.¹ Kim, Y.² Ha, C.-S.³

13
- 33744491547
- H. Ito, W. Oka, H. Goto, and H. Umeda: Jpn. J. Appl. Phys. 45 (2006) 4325.
- (2006) Jpn. J. Appl. Phys. , vol.45 , pp. 4325
- Ito, H.¹ Oka, W.² Goto, H.³ Umeda, H.⁴

14
- 0942290524
- W. A. MacDonald: J. Mater. Chem. 14 (2004) 4.
- (2004) J. Mater. Chem. , vol.14 , pp. 4
- MacDonald, W.A.¹

15
- 33845591193
- N. Watanabe, T. Kojima, and T. Asano: IEDM Tech. Dig., 2005, p. 687.
- (2005) IEDM Tech. Dig. , pp. 687
- Watanabe, N.¹ Kojima, T.² Asano, T.³

16
- 77952712937
- N. Watanabe, I. Tsunoda, T. Takao, K. Tanaka, and T. Asano: Jpn. J. Appl. Phys. 49 (2010) 04DB01.
- (2010) Jpn. J. Appl. Phys. , vol.49
- Watanabe, N.¹ Tsunoda, I.² Takao, T.³ Tanaka, K.⁴ Asano, T.⁵

17
- 79959386450
- T. Shuto, N. Watanabe, A. Ikeda, T. Higashimachi, and T. Asano: Jpn. J. Appl. Phys. 50 (2011) 06GM05.
- (2011) Jpn. J. Appl. Phys. , vol.50
- Shuto, T.¹ Watanabe, N.² Ikeda, A.³ Higashimachi, T.⁴ Asano, T.⁵

18
- 77952692895
- N. Watanabe and T. Asano: Jpn. J. Appl. Phys. 49 (2010) 04DB02.
- (2010) Jpn. J. Appl. Phys. , vol.49
- Watanabe, N.¹ Asano, T.²

19
- 77955190388
- N. Watanabe and T. Asano: Proc. Electronic Components and Technology Conf., 2010, p. 1763.
- (2010) Proc. Electronic Components and Technology Conf. , pp. 1763
- Watanabe, N.¹ Asano, T.²

20
- 79251573546
- N. Watanabe and T. Asano: Appl. Phys. Express 4 (2011) 016501.
- (2011) Appl. Phys. Express , vol.4 , pp. 016501
- Watanabe, N.¹ Asano, T.²

21
- 77958100253
- A. Ikeda, K. Kajiwara, N. Watanabe, and T. Asano: Jpn. J. Appl. Phys. 49 (2010) 08JA05.
- (2010) Jpn. J. Appl. Phys. , vol.49
- Ikeda, A.¹ Kajiwara, K.² Watanabe, N.³ Asano, T.⁴

22
- 84977631810
- T. Mori, N. Watanabe, and T. Asano: Proc. Int. Conf. Electronics Packaging, 2009, p. 392.
- (2009) Proc. Int. Conf. Electronics Packaging , pp. 392
- Mori, T.¹ Watanabe, N.² Asano, T.³

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