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Japanese Journal of Applied Physics

Volumn 53, Issue 6 SPEC. ISSUE, 2014, Pages

Through silicon via filling methods with metal/polymer composite for three-dimensional LSI

(3) Horváth, Barbara a Kawakita, Jin a Chikyow, Toyohiro a

a NATIONAL INSTITUTE FOR MATERIALS SCIENCE (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT INTERCONNECTS;

COPPER ELECTROPLATING; FABRICATION PROCESS; FILLING RATIO; IN-VACUUM; PROCESS METHODS; THROUGH SILICON VIAS; THROUGH-SILICON-VIA; VIA FILLING;

FILLING;

EID: 84903306838 PISSN: 00214922 EISSN: 13474065 Source Type: Journal
DOI: 10.7567/JJAP.53.06JH01 Document Type: Conference Paper

Times cited : (21)

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