Measuring the electrical resistivity and contact resistance of vertical carbon nanotube bundles for application as interconnects

Nanotechnology

Volumn 22, Issue 8, 2011, Pages

  Chiodarelli, Nicolo ^a,b   Masahito, Sugiura ^c   Kashiwagi, Yusaku ^c   Li, Yunlong ^a   Arstila, Kai ^a   Richard, Olivier ^a   Cott, Daire J ^a   Heyns, Marc ^a,d   Gendt, Stefan De ^a,d   Groeseneken, Guido ^a,b   Vereecken, Philippe M ^a,d  

^a IMEC   (Belgium)

^b Katholieke Universiteit Leuven   (Belgium)

^c TOKYO ELECTRON LTD   (Japan)

^d UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON NANOTUBE BUNDLE; CATALYTIC CHEMICAL VAPOR DEPOSITION; COPPER-BASED; ELECTRICAL PROPERTY; ELECTRICAL RESISTANCES; ELECTRICAL RESISTIVITY; FULLY COMPATIBLE; HIGH ASPECT RATIO; INTEGRATED STRUCTURE; INTEGRATION PROCESS; LOW TEMPERATURES; METAL CONTACTS; PROCESSING STEPS; SILICON TECHNOLOGIES; TWO PARAMETER;

ASPECT RATIO; CARBON NANOTUBES; CHEMICAL VAPOR DEPOSITION; CONTACT RESISTANCE; ELECTRIC CONDUCTIVITY; OPTIMIZATION; TUNGSTEN;

IMPACT RESISTANCE;

EID: 79251539866     PISSN: 09574484     EISSN: 13616528     Source Type: Journal    
DOI: 10.1088/0957-4484/22/8/085302     Document Type: Article

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