Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu

Journal of Materials Science

Volumn 46, Issue 11, 2011, Pages 3868-3882

  Okoro, Chukwudi ^a,b   Labie, Riet ^a   Vanstreels, Kris ^a   Franquet, Alexis ^a   Gonzalez, Mario ^a   Vandevelde, Bart ^a   Beyne, Eric ^a   Vandepitte, Dirk ^b   Verlinden, Bert ^b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRON BACK-SCATTERED DIFFRACTION; IMPURITY CONTENT; LASER SCANNING METHODS; MICRO-STRUCTURAL; NANOINDENTATION TECHNIQUES; SIGNIFICANT IMPACTS; THERMO-MECHANICAL; THERMO-MECHANICAL BEHAVIORS; TIME-OF-FLIGHT SECONDARY ION MASS SPECTROSCOPY; VOID-FREE;

ELECTRODEPOSITION; FILLING; INDENTATION; MECHANICAL ENGINEERING; RESIDUAL STRESSES; SECONDARY ION MASS SPECTROMETRY;

COPPER;

EID: 79953805281     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-011-5308-z     Document Type: Article

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