Plasma pretreatment of the Cu seed layer surface in Cu electroplating

Materials Chemistry and Physics

Volumn 73, Issue 2-3, 2002, Pages 227-234

  Oh, Junhwan ^a   Lee, Jaegab ^b   Lee, Chongmu ^a  

^a Inha University   (South Korea)

^b Kookmin University   (South Korea)

Author keywords

Copper; Electroplating; Plasma pretreatment; Seed layer

Indexed keywords

ADHESION; ELECTRIC CONDUCTIVITY; ELECTROPLATING; IMPURITIES; MAGNETRON SPUTTERING; MORPHOLOGY; PLASMA APPLICATIONS; SURFACE ROUGHNESS;

PLASMA PRETREATMENT;

COPPER;

EID: 0037081285     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0254-0584(01)00378-9     Document Type: Article

References (9)

1. Czchoslovak