Analysis of CNT based 3D TSV for emerging RF applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 2056-2059

  Gupta, Anurag ^a   Kim, Bruce C ^a   Kannan, Sukeshwar ^a   Evana, Sai Shravan ^a   Li, Li ^b  

^a UNIVERSITY OF ALABAMA   (United States)

^b CISCO SYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CU-BASED; EFFECTIVE SERIES RESISTANCES; EYE-DIAGRAM ANALYSIS; HIGH FREQUENCY; HIGH FREQUENCY HF; HIGH THROUGHPUT; HIGH TRANSMISSION; INTEGRATED MODELS; LOW DISTORTION; MONOLITHIC CAPACITORS; OUTPUT PORTS; PARASITICS; REACTIVE COMPONENTS; REFLECTION LOSS; RF APPLICATIONS; WIRELESS APPLICATION;

MILITARY COMMUNICATIONS; THREE DIMENSIONAL; WIRELESS TELECOMMUNICATION SYSTEMS;

MILITARY APPLICATIONS;

EID: 79960390584     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898800     Document Type: Conference Paper

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