Copper electroplating for future ultralarge scale integration interconnection

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 18, Issue 2, 2000, Pages 656-660

  Gau, W C ^a   Chang, T C ^b,c   Lin, Y S ^a   Hu, J C ^d   Chen, L J ^d   Chang, C Y ^e   Cheng, C L ^a  

^a CHUNG YUAN CHRISTIAN UNIVERSITY   (Taiwan)

^b National Nano Dvice Laboratory   (Taiwan)

^c NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^d NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^e NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; AMINES; CURRENT DENSITY; ELECTRIC RESISTANCE; ELECTROLYTES; ELECTROPLATING; METALLIC FILMS; MORPHOLOGY; POLYETHYLENE GLYCOLS; UREA;

COPPER ELECTROPLATING; COPPER FILLING; ELECTROLYTE CONCENTRATION; ELECTROLYTE SOLUTIONS; HYDROXYL AMINE SULFATE; METALLIC ION CONCENTRATION; THIOUREA;

COPPER;

EID: 0034156429     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.582243     Document Type: Article

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