Strong adhesion of silver/polypyrrole composite onto plastic substrates toward flexible electronics

Japanese Journal of Applied Physics

Volumn 52, Issue 6 PART 2, 2013, Pages

  Kawakita, Jin ^a   Hashimoto, Yasuo ^a   Chikyow, Toyohiro ^a  

^a NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION TO SUBSTRATE; ANCHORING EFFECTS; FLUID DISPERSIONS; INTERFACIAL STRUCTURES; PLASTIC SUBSTRATES; PURE METALS;

ADHESION; ELECTRIC WIRING; FLEXIBLE ELECTRONICS; POLYMERS;

SUBSTRATES;

EID: 84880996057     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.7567/JJAP.52.06GG12     Document Type: Conference Paper

References (30)

1. K. Suganuma and H. Tanaami: Purinteddo Erekutoronikusu Gijutu (Printed Electronics) (Kogyo Chosakai, Tokyo, 2008) p. 16 [in Japanese].
2. K. Numakura: Yoku Wakaru Furekishiburu Erekutoronikusu no Dekiru Made (Easy Understanding of Flexibile Electronics Fabrication) (Nikkan Kogyo Shinbun, Tokyo, 2010) p. 16 [in Japanese].
3. K. Suganuma and H. Tanaami: Purinteddo Erekutoronikusu Gijutu (Printed Electronics) (Kogyo Chosakai, Tokyo, 2008) p. 45 [in Japanese].
4. Dodensei Kobunshi no Saishin Gijutsu (Latest Technologies of Conducting Polymers) (Toray Research Center, Tokyo, 2010) p. 30 [in Japanese].
5. M. Kobayashi: Kogyo Zairyo 56 (2008) 23 [in Japanese].
6. P. Dallas, D. Niarchos, D. Vrbanic, N. Boukos, S. Pejovnik, C. Trapalis, and D. Petridis: Polymer 48 (2007) 2007.
7. X. Yang and Y. Lu: Mater. Lett. 59 (2005) 2484.
8. L. M. Huang and T. C. Wen: Mater. Sci. Eng. A 445-446 (2007) 7.
9. Y. Wei, L. Li, X. Yang, G. Pan, G. Yan, and X. Yu: Nanoscale Res. Lett. 5 (2009) 433.
10. J. Puišo, I. Prosyčevas, A. Guobiene?, and S. Tamulevičius: Mater. Sci. Eng. B 149 (2008) 230.
11. X. Yang, L. Li, and F. Yan: Sens. Actuators B 145 (2010) 495.
12. S. N. Mailu, T. T. Waryo, P. M. Ndangili, F. R. Ngece, A. A. Baleg, P. G. Baker, and E. I. Iwuoha: Sensors 10 (2010) 9449.
13. E. Park, O. S. Kwon, S. J. Park, J. S. Lee, S. You, and J. Jang: J. Mater. Chem. 22 (2012) 1521.
14. R. A. de Barros, W. M. de Azevedo, and F. M. de Aguiar: Mater. Charact. 50 (2003) 131.
15. C. R. Martins, Y. M. de Almeida, G. C. do Nascimento, and W. M. de Azevedo: J. Mater. Sci. 41 (2006) 7413.
16. R. A. de Barros, M. C. C. Areias, and W. M. de Azevedo: Synth. Met. 160 (2010) 61.
17. J. Kawakita, H. Fujihira, T. Chikyow, and Y. Sakamoto: to be published in ECS Trans.
18. Z. Shi, H. Wang, T. Dai, and Y. Lu: Synth. Met. 160 (2010) 2121.
19. R. A. de Barros and W. M. de Azevedo: Synth. Met. 158 (2008) 922.
20. J. Stejskal, J. Prokes, and I. Sapurina: Mater. Lett. 63 (2009) 709.
21. S. Bouazza, V. Alonzo, and D. Hauchard: Synth. Met. 159 (2009) 1612.
22. L. J. Borthakur, S. Sharma, and S. K. Dolui: J. Mater. Sci.: Mater. Electron. 22 (2011) 949.
23. Y. J. Jung, P. Govindaiah, S. W. Choi, I. W. Cheong, and J. H. Kim: Synth. Met. 161 (2011) 1991.
24. C. Zhao, Q. Zhao, Q. Zhao, J. Qiu, C. Zhu, and S. Guo: J. Photochem. Photobiol. A 187 (2007) 146.
25. V. S. Ijeri, J. R. Nair, C. Gerbaldi, R. S. Gonnelli, S. Bodoardo, and R. M. Bongiovanni: Soft Matter 6 (2010) 4666.
26. J. Kawakita and T. Chikyow: Jpn. J. Appl. Phys. 51 (2012) 06FG11.
27. J. R. Nair, V. S. Ijeri, C. Gerbaldi, S. Bodoardo, R. Bongiovanni, and N. Penazzi: Org. Electron. 11 (2010) 1802.
28. JIS Z1522 (2009).
29. K. Nagata: Setchaku no Hanashi (Explanation of Adhesion) (Japanese Standards Association, Tokyo, 1982) p. 25 [in Japanese].
30. K. Inada: Toa Gosei Kenkyu Nenpo 9 (2006) 19 [in Japanese].