Mechanical lapping, handling and transfer of ultra-thin wafers

Journal of Micromechanics and Microengineering

Volumn 8, Issue 4, 1998, Pages 338-342

  Pinel, S ^a   Tasselli, J ^a   Bailbe J P ^a   Marty, A ^a   Puech, P ^b   Esteve D ^a  

^a LAAS CNRS   (France)

^b UNIVERSITÉ DE TOULOUSE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

LAPPING; MATERIALS HANDLING; MOSFET DEVICES; MULTICHIP MODULES; SEMICONDUCTING GALLIUM ARSENIDE; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS; SUBSTRATES; ULTRATHIN FILMS;

THINNING METHOD; ULTRA THIN WAFERS;

MICROELECTRONIC PROCESSING;

EID: 0032295626     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/8/4/013     Document Type: Article

References (8)

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