SCOPUS 정보 검색 플랫폼

Micro and Nano Letters

Volumn 7, Issue 12, 2012, Pages 1220-1222

Non-planar surface bonding with spray-coated SU-8 as adhesive layer

(5) Li, Nannan a He, Shuwei a Zhao, Qiancheng a Zhang, Shibin a Chen, Jing a

a PEKING UNIVERSITY (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE LAYERS; ALIGNMENT TOLERANCE; BONDING SURFACES; NON-PLANAR SURFACES; PLANAR SURFACE; SHEARING STRENGTH; THREE-DIMENSIONAL STRUCTURE; WAFER LEVEL;

ADHESIVES; ELECTROMECHANICAL DEVICES; MEMS; TENSILE STRENGTH;

WAFER BONDING;

ADHESIVE AGENT; SU 8; UNCLASSIFIED DRUG;

ARTICLE; CHEMICAL BINDING; SURFACE PROPERTY;

EID: 84878358424 PISSN: None EISSN: 17500443 Source Type: Journal
DOI: 10.1049/mnl.2012.0582 Document Type: Article

Times cited : (2)

References (8)

1
- 0032136370
- Wafer-to-wafer bonding for microstructure formation
- 10.1109/5.704262
- - 10.1109/5.704262 Schmidt M.A. Wafer-to-wafer bonding for microstructure formation Proc. IEEE 11th Int. Conf. MEMS, Heidelberg, Germany 1998 86 1575-1585
- (1998) Proc. IEEE 11th Int. Conf. MEMS, Heidelberg, Germany , vol.86 , pp. 1575-1585
- Schmidt, M.A.¹

2
- 0027061092
- Batch fabrication and assembly of micromotor-driven mechanisms with multi-level linkages
- Gianchandani Y. Batch fabrication and assembly of micromotor-driven mechanisms with multi-level linkages Proc. IEEE 5th Int. Conf. MEMS, Travemünde, Germany 141-146
- Proc. IEEE 5th Int. Conf. MEMS, Travemünde, Germany , pp. 141-146
- Gianchandani, Y.¹

3
- 64549139638
- A 300 mm wafer-level three-dimensional integration scheme using tungsten through-silicon via and hybrid Cu-adhesive bonding
- Liu F. Yu R.R. Young A.M. A 300 mm wafer-level three-dimensional integration scheme using tungsten through-silicon via and hybrid Cu-adhesive bonding Proc. IEEE Int. IEDM, San Francisco, CA, USA 2008 1-4
- (2008) Proc. IEEE Int. IEDM, San Francisco, CA, USA , pp. 1-4
- Liu, F.¹ Yu, R.R.² Young, A.M.³

4
- 84878354956
- A bump transfer method for flip chip assembly
- Zhang J. Wang C.H. A bump transfer method for flip chip assembly Proc. IEEE 5th Int. Conf. EPTC, Singapore 2003 321-323
- (2003) Proc. IEEE 5th Int. Conf. EPTC, Singapore , pp. 321-323
- Zhang, J.¹ Wang, C.H.²

5
- 33645536175
- Adhesive wafer bonding
- 10.1063/1.2168512 0021-8979
- - 10.1063/1.2168512 Niklaus F. Stemme G. Lu J.-Q. Gutmann R.J. Adhesive wafer bonding J. Appl. Phys. 0021-8979 2006 99 031101
- (2006) J. Appl. Phys. , vol.99 , pp. 031101
- Niklaus, F.¹ Stemme, G.² Lu, J.-Q.³ Gutmann, R.J.⁴

6
- 0036735653
- A low-temperature wafer bonding technique using patternable materials
- 10.1088/0960-1317/12/5/315 0960-1317
- - 10.1088/0960-1317/12/5/315 Pan C.-T. Yang H. Shen S.-C. Chou M.-C. Chou H.-P. A low-temperature wafer bonding technique using patternable materials J. Micromech. Microeng. 0960-1317 2002 12 611-615
- (2002) J. Micromech. Microeng. , vol.12 , pp. 611-615
- Pan, C.-T.¹ Yang, H.² Shen, S.-C.³ Chou, M.-C.⁴ Chou, H.-P.⁵

7
- 42549121570
- Wafer bonding with BCB and SU-8 for MEMS packaging
- 10.1109/ESTC.2006.280194
- - 10.1109/ESTC.2006.280194 Wiemer M. Jia C. Toepper M. Hauck K. Wafer bonding with BCB and SU-8 for MEMS packaging Proc. 1st Int. Conf. ESTC, Dresden, Germany 2006 2 1401-1405
- (2006) Proc. 1st Int. Conf. ESTC, Dresden, Germany , vol.2 , pp. 1401-1405
- Wiemer, M.¹ Jia, C.² Toepper, M.³ Hauck, K.⁴

8
- 60649117796
- Wafer bonding with intermediate parylene layer
- Shu Q. Chen X.H.J. Wafer bonding with intermediate parylene layer Proc. 9th Int. Conf. ISCICT, Beijing, China 2008 2428-2431
- (2008) Proc. 9th Int. Conf. ISCICT, Beijing, China , pp. 2428-2431
- Shu, Q.¹ Chen, X.H.J.²

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