Overview and emerging challenges in wafer thinning process for handheld applications

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2006, Pages 20-26

  Ganesh, V P ^a   Lee, Charles ^a  

^a INFINEON TECHNOLOGIES ASIA PACIFIC PTE LTD   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

3-D PACKAGING; CHIP STRENGTH; ELECTRONICS MANUFACTURING; HANDHELD; INTERNATIONAL CONFERENCES; WAFER THINNING; WAFER-THINNING PROCESS;

CHIP SCALE PACKAGES; ELECTRONIC EQUIPMENT MANUFACTURE; NONMETALS; SILICON; SILICON WAFERS; TECHNOLOGY;

ELECTRONICS PACKAGING;

EID: 50249151871     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.2006.4456426     Document Type: Conference Paper

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