SCOPUS 정보 검색 플랫폼

Volumn 4, Issue 31, 2014, Pages 15914-15922

Ultra-fast photonic curing of electrically conductive adhesives fabricated from vinyl ester resin and silver micro-flakes for printed electronics

(7) Cui, Hui Wang a Jiu, Jin Ting a Nagao, Shijo a Sugahara, Tohru a Suganuma, Katsuaki a Uchida, Hiroshi b Schroder, Kurt A c

a OSAKA UNIVERSITY (Japan)

b High Performance Materials Department (Japan)

c LLC 200 B Parker Drive ^* (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMBIENT ATMOSPHERE; CONDUCTIVE ADHESIVE; ELECTRICALLY CONDUCTIVE; ELECTRICALLY CONDUCTIVE ADHESIVES; INTENSE PULSED LIGHT; PRINTED ELECTRONICS; ULTRA-FAST PHOTONICS; VINYL ESTER RESIN;

ADHESIVES; ESTERS; IDENTIFICATION (CONTROL SYSTEMS); PHOTOSENSITIZERS; RESINS; SILVER;

CURING;

EID: 84898060530 PISSN: None EISSN: 20462069 Source Type: Journal
DOI: 10.1039/c4ra00292j Document Type: Article

Times cited : (55)

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