Joining of molybdenum thin films with copper printed circuit board by laser micro-riveting

Optics and Laser Technology

Volumn 49, Issue , 2013, Pages 320-324

  Zimmer, Klaus ^a   Ehrhardt, Martin ^a   Lorenz, Pierre ^a   Stephan, Tino ^a   Ebert, Robby ^b   Braun, Alexander ^c  

^a LEIBNIZ INSTITUTE OF SURFACE ENGINEERING IOM   (Germany)

^b Hochschule Mittweida   (Germany)

^c Solarion AG   (Germany)

Author keywords

Joining; Laser; Thin film

Indexed keywords

DIFFERENT MATERIALS; FLEXIBLE POLYMER SUBSTRATES; INTERCONNECTION TECHNOLOGY; MATERIAL TRANSPORT; MECHANICAL AND ELECTRICAL; MECHANICAL CONNECTIONS; SINGLE LASER PULSE; THIN FILM MATERIAL;

COPPER; DISSIMILAR MATERIALS; ELECTRIC CONNECTORS; LASERS; PHASE TRANSITIONS; RIVETS; THIN FILM DEVICES; THIN FILMS;

JOINING;

EID: 84874884615     PISSN: 00303992     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.optlastec.2013.01.021     Document Type: Article

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