Industrial pressure sensitive adhesives suitable for physicochemical microencapsulation

International Journal of Adhesion and Adhesives

Volumn 31, Issue 7, 2011, Pages 629-633

  Abderrahmen, R ^a   Gavory, C ^b   Chaussy, D ^a   Briancon S ^b   Fessi, H ^b   Belgacem, M N ^a  

^a Laboratory of Pulp and Paper Industry LGP2 UMR CNRS 5518   (France)

^b UNIVERSITÉ LYON 1   (France)

Author keywords

Microencapsulation; Peel; Pressure sensitive; Water based

Indexed keywords

ACETONE; ORGANIC SOLVENTS; PARTICLE SIZE; PARTICLE SIZE ANALYSIS; PEELING;

ELECTRICAL CONDUCTIVITY; INDUSTRIAL WATER; LIGHT PRESSURES; MICROENCAPSULATION PROCESS; PHYSICOCHEMICAL PROCESS; PRESSURE SENSITIVE; PRESSURE-SENSITIVE ADHESIVES; WATER BASED;

MICROENCAPSULATION;

EID: 80051903572     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2011.06.003     Document Type: Article

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