Drop-on-demand laser sintering with silver nanoparticles for electronics packaging

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 2, Issue 5, 2012, Pages 868-877

  Maekawa, Katsuhiro ^a   Yamasaki, Kazuhiko ^a   Niizeki, Tomotake ^a   Mita, Mamoru ^b   Matsuba, Yorishige ^c   Terada, Nobuto ^c   Saito, Hiroshi ^c  

^a IBARAKI UNIVERSITY   (Japan)

^b M and M Research Laboratory   (Japan)

^c Harima Chemicals Inc   (Japan)

Author keywords

Adhesivity; ink jet printing; laser sintering; leadframe; metal nanoparticles; metallization; patterning; plating; wire bonding

Indexed keywords

ADHESIVITY; LASER SINTERING; LEAD-FRAME; PATTERNING; WIRE BONDING;

ADHESION; ARGON; ATMOSPHERIC MOVEMENTS; COPPER; ELECTRONICS PACKAGING; HEAT RESISTANCE; INFRARED DEVICES; INK JET PRINTING; LASER HEATING; METAL NANOPARTICLES; METALLIZING; PLATING; POLYIMIDES; SINTERING;

SILVER;

EID: 84860869815     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2011.2178606     Document Type: Article

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