Mechanisms of photonic curing™: Processing high temperature films on low temperature substrates

Technical Proceedings of the 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011

Volumn 2, Issue , 2011, Pages 220-223

  Schroder, K A ^a  

^a NCC Nano LLC   (United States)

Author keywords

Conductive; Copper; Curing; Photonic; Sintering

Indexed keywords

CONDUCTIVE; ELECTRONIC PERFORMANCE; FLASHLAMPS; HIGH TEMPERATURE; HIGH-SPEED PRINTING; HIGH-SPEED PROCESSING; IN-LINE; LOW COSTS; LOW TEMPERATURES; PHOTONIC MODULATION; POLYMER SUBSTRATE; PRINTED ELECTRONICS; RIGID SUBSTRATES;

COMPUTER SIMULATION; COPPER; CURING; FLUIDICS; HIGH SPEED CAMERAS; NANOTECHNOLOGY; PHOTONICS; SINTERING; THIN FILMS;

SUBSTRATES;

EID: 81455144713     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. K. A. Schroder, S. C. McCool, W. R. Furlan, Technical Proceedings of the 2006 NSTI Nanotechnology Conference and Trade Show, 3, 198-201, 2006.
2. J. West, M. Carter, S. Smith, and J. Sears, Technical Proceedings of the 2010 NSTI Nanotechnology Conference and Expo, 2, 210-213, 2010.
3. US Pat. #7,820,097.