-
1
-
-
0037352438
-
Analysis of correlation between percolation and elongation at break in filled electroconductive epoxy-based adhesives
-
I. Novak, I. Krupa, and I. Chodak Analysis of correlation between percolation and elongation at break in filled electroconductive epoxy-based adhesives Eur Polym J 39 2003 585 592
-
(2003)
Eur Polym J
, vol.39
, pp. 585-592
-
-
Novak, I.1
Krupa, I.2
Chodak, I.3
-
2
-
-
0036567374
-
Preparation of nickel coated mica as a conductive filler
-
DOI 10.1016/S1359-835X(01)00148-8, PII S1359835X01001488
-
G. Jiang, M. Gilbert, D.J. Hitt, G.D. Wilcox, and K. Balasubramanian Preparation of nickel coated mica as a conductive filler Composites A33 2002 745 751 (Pubitemid 34405730)
-
(2002)
Composites - Part A: Applied Science and Manufacturing
, vol.33
, Issue.5
, pp. 745-751
-
-
Jiang, G.1
Gilbert, M.2
Hitt, D.J.3
Wilcox, G.D.4
Balasubramanian, K.5
-
3
-
-
79953716821
-
The combined effects of carbon black and carbon fiber on the electrical properties of composites based on polyethylene or polyethylene/polypropylene blend
-
L. Shen, F. Wang, H. Yang, and Q. Meng The combined effects of carbon black and carbon fiber on the electrical properties of composites based on polyethylene or polyethylene/polypropylene blend Polym Test 30 2011 442 448
-
(2011)
Polym Test
, vol.30
, pp. 442-448
-
-
Shen, L.1
Wang, F.2
Yang, H.3
Meng, Q.4
-
5
-
-
0035311330
-
Electrical reliability of electrically conductive adhesive joints: Dependence on curing condition and current density
-
DOI 10.1016/S0026-2692(01)00007-6, PII S0026269201000076
-
H. Kim, and F. Shi Electrical reliability of electrically conductive adhesive joints: dependence on curing condition and current density Microelectron J 32 2001 315 321 (Pubitemid 32279336)
-
(2001)
Microelectronics Journal
, vol.32
, Issue.4
, pp. 315-321
-
-
Kim, H.K.1
Shi, F.G.2
-
6
-
-
84985519146
-
Dieelektrochemische Polymerisation. Ein interessantes Prinzip zur Synthese von elektrisch leitfähigen Polymeren
-
H. Naarmann Dieelektrochemische Polymerisation. Ein interessantes Prinzip zur Synthese von elektrisch leitfähigen Polymeren Angew Makromol Chem 162 1988 1 17
-
(1988)
Angew Makromol Chem
, vol.162
, pp. 1-17
-
-
Naarmann, H.1
-
7
-
-
84861340489
-
Electrical conductive acrylic pressure-sensitive adhesives
-
Nürnberg, Mai, 2007 paper VII 5
-
Milker R., Czech Z., Klementowska P. Electrical conductive acrylic pressure-sensitive adhesives, European Coating Show 2007, Nürnberg, Mai, 2007 paper VII 5.
-
(2007)
European Coating Show
-
-
Milker, R.1
Czech, Z.2
Klementowska, P.3
-
9
-
-
13744254966
-
Non-uniformity of the filler concentration and of the transverse thermal and electrical conductivities of filled polymer plates
-
DOI 10.1016/j.compscitech.2004.10.017, PII S0266353804002921
-
F. Danes, B. Garnier, T. Dupuis, P. Lerendu, and T. Nguyen Non-uniformity of the filler concentration and of the transverse thermal and electrical conductivities of filled polymer plates Compos Sci Technol 65 2005 945 951 (Pubitemid 40240386)
-
(2005)
Composites Science and Technology
, vol.65
, Issue.6
, pp. 945-951
-
-
Danes, F.1
Garnier, B.2
Dupuis, T.3
Lerendu, P.4
Nguyen, T.-P.5
-
10
-
-
84861347597
-
Elektrisch leitfähige Acrylathaftklebstoffe
-
R. Milker, Z. Czech, and P. Klementowska Elektrisch leitfähige Acrylathaftklebstoffe Adhäsion 7-8 2007 4 8
-
(2007)
Adhäsion
, vol.7-8
, pp. 4-8
-
-
Milker, R.1
Czech, Z.2
Klementowska, P.3
-
11
-
-
33745197112
-
High conductivity of isotropic conductive adhesives filled with silver nanowires
-
H.P. Wu, J.F. Liu, X. Wu, M. Ge, Y. Wang, and G. Zhang High conductivity of isotropic conductive adhesives filled with silver nanowires Int J Adhes Adhes 26 2006 617 621
-
(2006)
Int J Adhes Adhes
, vol.26
, pp. 617-621
-
-
Wu, H.P.1
Liu, J.F.2
Wu, X.3
Ge, M.4
Wang, Y.5
Zhang, G.6
|