Solid-state annealing behavior of two high-Pb solders, 95Pb5Sn and 90Pb10Sn, on Cu under bump metallurgy

Journal of Electronic Materials

Volumn 34, Issue 10, 2005, Pages

  Ramanathan, L N ^a   Jang, J W ^a   Lin, J K ^a   Frear, D R ^a  

^a FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

90Pb10Sn; 95Pb5Sn; Annealing; Cu under bump metallurgy (UBM)

Indexed keywords

ANNEALING; INTERDIFFUSION (SOLIDS); INTERMETALLICS;

CU UNDER BUMP METALLURGY (UBM); INTERMETALLIC GROWTH; SOLID-STATE ANNEALING;

SOLDERING ALLOYS;

EID: 27144489459     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0262-7     Document Type: Article

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