Design, processing and reliability characterizations of a 3D-WLCSP packaged component

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 972-979

  Li, Zhaozhi ^a,c   Houston, Paul N ^a   Baldwin, Daniel F ^a   Stout, Eugene A ^a,b   Tessier, Theodore G ^a,b   Evans, John L ^a,c  

^a ENGENT Inc   (United States)

^b FlipChip International LLC   (United States)

^c AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AIR-TO-AIR THERMAL CYCLING; COST EFFECTIVE; DESIGN CONSIDERATIONS; LEAD-FREE; LOWER COST; MANUFACTURING PROCESS; MARKET DEMAND; PACKAGE DENSITY; PACKAGE STRUCTURE; PACKAGING DENSITY; PACKAGING SOLUTIONS; PROCESSING TECHNOLOGIES; RELIABILITY CHARACTERIZATION; RELIABILITY PERFORMANCE; SECOND LEVEL; SMALL PACKAGE; STAND-OFF; TEST VEHICLE; THREE-DIMENSIONAL (3D) PACKAGING; TIME TO MARKET; UNDERFILLS; WAFER BUMPING; WAFER INTEGRATION TECHNOLOGY; WAFER LEVEL; WAFER LEVEL CSP; WAFER THINNING;

AUTOMOBILE PARTS AND EQUIPMENT; COMPUTER OPERATING PROCEDURES; CONCURRENT ENGINEERING; TECHNOLOGY; THREE DIMENSIONAL;

ELECTRONICS PACKAGING;

EID: 70349680427     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074131     Document Type: Conference Paper

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