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Journal of Materials Science: Materials in Electronics

Volumn 22, Issue 9, 2011, Pages 1443-1449

Effect of nano-TiO 2 addition on the microstructure and bonding strengths of Sn3.5Ag0.5Cu composite solder BGA packages with immersion Sn surface finish

(4) Leong, J C a Tsao, L C a Fang, C J b Chu, C P a

a NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY (Taiwan)

b CHINA STEEL CORPORATION (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAY PACKAGES; BGA PACKAGE; BONDING STRENGTH; COMPOSITE SOLDERS; FRACTURE MODE; IMMERSION SN; INTERFACIAL INTERMETALLICS; INTERFACIAL MICROSTRUCTURE; NANO-TIO; PARTICLE ADDITION; PEAK SHEAR STRENGTH; SOLDER JOINTS; SURFACE FINISHES; TIO;

BOND STRENGTH (CHEMICAL); DIFFUSION BONDING; FINISHING; INTERMETALLICS; MICROSTRUCTURE; SHEAR STRENGTH; SOLDERED JOINTS; SOLDERING ALLOYS; TITANIUM DIOXIDE;

TIN;

EID: 80054074627 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-011-0327-8 Document Type: Article

Times cited : (48)

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