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Journal of Materials Science: Materials in Electronics

Volumn 23, Issue 1, 2012, Pages 68-74

Effect of Ti on the interfacial reaction between Sn and Cu

(3) Vuorinen, V a Dong, H Q a Laurila, T a

a AALTO UNIVERSITY (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

CU-SN INTERMETALLICS; IMC LAYER; SN-AG SOLDER; SOLDER MATRIX; SOLID-STATE ANNEALING;

PHASE DIAGRAMS; SOLDERING ALLOYS; SOLID STATE REACTIONS; SOLUBILITY;

TIN;

EID: 84856967941 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-011-0426-6 Document Type: Article

Times cited : (17)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.