Active soldering of ZnS-SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal

Journal of Materials Processing Technology

Volumn 202, Issue 1-3, 2008, Pages 22-26

  Chang, S Y ^a   Chuang, T H ^b   Tsao, L C ^b   Yang, C L ^a   Yang, Z S ^a  

^a NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Active soldering; Copper; Ga); Sn3.5Ag4Ti(Ce; ZnS SiO2

Indexed keywords

RARE EARTH ELEMENTS; SHEAR STRENGTH; SOLDERING; SPUTTERING; SURFACE CHEMISTRY;

ACTIVE SOLDERING; BONDING MECHANISM; CERAMIC BONDING; COPPER BACKING PLATES; METAL FILLERS;

ZINC COMPOUNDS;

EID: 42949140803     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2007.08.045     Document Type: Article

References (12)

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