Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes

Journal of Electronic Materials

Volumn 35, Issue 2, 2006, Pages 302-309

  Chuang, T H ^a   Yen, S F ^a   Cheng, M D ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Au Ni surface finishes; Ball grid array package; Intermetallic compounds; Sn3Ag0.5Cu; Sn3Ag0.5Cu0.06Ni0.01Ge

Indexed keywords

AU/NI SURFACE FINISHES; BALL-GRID-ARRAY PACKAGE; SN3AG0.5CU; SN3AG0.5CU0.06NI0.01GE;

COPPER; FINISHING; GERMANIUM; GOLD; NICKEL; SOLDERING ALLOYS;

INTERMETALLICS;

EID: 33644893068     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02692450     Document Type: Conference Paper

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