Multiscale modeling of the interfacial fracture behavior in the Sn-Cu 6 Sn 5-Cu system

Journal of Computational and Theoretical Nanoscience

Volumn 8, Issue 5, 2011, Pages 873-880

  Fei, Huiyang ^a   Yazzie, Kyle ^a   Williams, Jason ^a   Chawla, Nikhilesh ^a   Jiang, Hanqing ^a  

^a Arizona State University   (United States)

Author keywords

Cohesive energy; Interfaces; Intermetallic (IMC) materials

Indexed keywords

COHESIVE ENERGIES; COHESIVE LAWS; CONSTITUTIVE RELATIONS; ELECTRONIC PACKAGE; ELECTRONICS PACKAGE; FRACTURE BEHAVIOR; INFORMED DECISION; INTERFACIAL FRACTURE; INTERFACIAL STRESS; MICROSTRUCTURAL MECHANISMS; MODIFIED EMBEDDED ATOM METHODS; MULTI-SCALE MODELING; PB FREE SOLDERS; PB-FREE ALLOYS; PURE SN; SOLDER JOINTS;

FRACTURE; INTERFACES (MATERIALS); INTERMETALLICS; LEAD; MOLECULAR DYNAMICS;

TIN;

EID: 84863012045     PISSN: 15461955     EISSN: None     Source Type: Journal    
DOI: 10.1166/jctn.2011.1767     Document Type: Article

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