Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull

Microelectronics Reliability

Volumn 49, Issue 8, 2009, Pages 846-852

  Zaal, J J M ^b   Hochstenbach, H P ^a   van Driel, W D ^a,b   Zhang, G Q ^a,b  

^a NXP SEMICONDUCTORS   (Netherlands)

^b DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

DROP IMPACT; DROP IMPACT LOADING; HIGH-SPEED; INTERCONNECT RELIABILITY; LIFE SPAN; MICROELECTRONIC COMPONENTS; MOBILE APPLIANCES; PULL-OFF; RELIABILITY PARAMETERS; SOLDER BUMP; SOLDER JOINTS; TEST APPARATUS; TEST TECHNIQUES; VERTICAL DIRECTION;

BRAZING; DROPS; IMPACT TESTING; NATURAL FREQUENCIES; STRAIN RATE; TELECOMMUNICATION EQUIPMENT;

WELDING;

EID: 67650444297     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2009.03.008     Document Type: Article

References (12)

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