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Volumn 41, Issue 2, 2012, Pages 375-389
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Fracture of Sn-Ag-Cu solder joints on Cu substrates: I. Effects of loading and processing conditions
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Author keywords
high strain rate fracture; joint fracture; lead free solders; mixed mode fracture; SAC
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Indexed keywords
CRITICAL ENERGY RELEASE RATE;
CU SUBSTRATE;
DESIGN CONSIDERATIONS;
DWELL TIME;
FRACTURE BEHAVIOR;
FRACTURE MECHANISMS;
FRACTURE RESPONSE;
HIGH STRAIN RATES;
INTERMETALLIC LAYER;
JOINT FRACTURE;
JOINT PROCESSING;
LEAD FREE SOLDERS;
LOADING ANGLE;
LOADING CONDITION;
MICROELECTRONIC PACKAGE;
MIXED MODE;
MIXED MODE FRACTURE;
MIXED-MODE CONDITIONS;
MODE MIXITY;
PROCESS PARAMETERS;
PROCESSING CONDITION;
REFLOW CONDITIONS;
REFLOW TEMPERATURES;
SAC;
SNAGCU SOLDER;
SOLDER JOINTS;
CHIP SCALE PACKAGES;
CRACK PROPAGATION;
FRACTURE TOUGHNESS;
INTERFACES (MATERIALS);
LEAD;
LOADING;
MICROELECTRONIC PROCESSING;
MICROELECTRONICS;
MICROSTRUCTURE;
PACKAGING MATERIALS;
SOLDERING ALLOYS;
STRAIN RATE;
SUBSTRATES;
TIN;
FRACTURE;
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EID: 84855471352
PISSN: 03615235
EISSN: None
Source Type: Journal
DOI: 10.1007/s11664-011-1769-8 Document Type: Article |
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Times cited : (36)
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References (43)
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