Ductile-to-brittle transition strain rate

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2006, Pages 283-289

  Darveaux, Robert ^a,b   Reichman, Corey ^a  

^a AMKOR TECHNOLOGY   (United States)

^b ARIZONA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

LOADING MODES;

BRAZING; COMPUTER NETWORKS; COPPER; DUCTILITY; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FAILURE ANALYSIS; LEAD; LOADING; METALLIZING; THERMAL AGING; WELDING;

STRAIN RATE;

EID: 50349101252     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2006.342730     Document Type: Conference Paper

References (13)

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