Mechanical loading of flip chip joints before underfill: The impact on yield and reliability

Microelectronics Reliability

Volumn 44, Issue 5, 2004, Pages 805-814

  Stepniak, Frank ^a  

^a DELPHI CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FRACTURE TOUGHNESS; MAGNETIC FLUX; SEMICONDUCTING INTERMETALLICS; SEMICONDUCTOR DOPING; SHEAR STRENGTH; THERMAL CYCLING; THERMAL EXPANSION;

BUMP DAMAGE; MECHANICAL LOADING;

FLIP CHIP DEVICES;

EID: 1842842319     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2003.08.006     Document Type: Article

References (21)

1. Johnson R.W. Gilleo K. Area array packaging handbook. 2002;McGraw Hill, New York.
2. Iida K. Low cycle fatigue. In: Solomon, Halford, Kaisand, Leis, editors. ASTM special technical publication, vol. 942. 1985. p. 160-71.
3. Witty MR, Sellers RL, Rosson JM, Walker GG, Meehan MP, Vadas RL, et al. Flip chip assembly on rigid organic laminates. Proc Int Conf Multichip Modules, MCM 98, April 1998. p. 87-94.
4. http://www.delphiauto.com/products/manufacturers/microelectronics/ testdie.
5. Stepniak F. Estimating flip chip reliability: interactive, temperature-dependent failure mechanisms. 1999;IMAPS, Chicago. p. 427-32.
6. Timenshenko S.P., Woinowsky-Krieger S. Plates and shells. 1959;McGraw-Hill, NY.
7. Parker R.D., Fields H.L., Ward D.K. A perspective of flip chip technology in automotive electronics. 2000;SMTA, Chicago. p. 157-67.
8. Stepniak F. Failure criteria of flip chip joints during accelerated testing. Microelectron. Reliab. 42:2002;1921-1930.
9. Stepniak F. Conversion of the UBM into intermetallics: the impact on flip chip reliability. Microelectron. Reliab. 41:2001;735-744.
10. Kececioglu D. Reliability engineering handbook, vol. 1. Saddle River, NJ: Prentice-Hall; 1991. p. 271-331.
11. Katchmar R. Overload fracture of packager solder joints. Microelectron. Reliab. 40:2000;123-129.
12. Darveaux R., Syed A. Reliability of area array solder joints in bending. 2000;SMTA, Chicago. p. 313-24.
13. Hull D., Bacon D.J. Introduction to dislocations. 1984;Pergamon Press, NY.
14. Li L, Jang JW, Allmen B. Shear property and microstructure evaluation of Pb-free solder bumps under room temp and multiple reflow/temp aging. Int Symp Adv Pack Mater, 2001. p. 347-53.
15. Popelar S., Strandjord A., Niemet B. A compatibility evaluation of lead-based and lead-free solder alloys in conjunction with electroless nickel flip chip UBM. 2001;IMAPS, Baltimore. p. 575-80.
16. Wiese S., Schubert A., Walter H., Dudek R., Feustel F., Meusel E., et al. Constitutive behavior of lead free solders vs. lead containing solders: experiments on bulk specimens and flip chip joints. 2001;ECTC. p. 890-901.
17. Charles S., Kropp M., Kinney R., Hackett S., Zenner R., Li F., et al. Pre-applied underfill adhesives for flip chip attachment. 2001;IMAPS, Baltimore. p. 178-82.
18. Post S. Private communication; 2002.
19. Geng P., Chen P., Ling Y. Effect of strain rate on solder joint failure under mechanical load. 2002;ECTC. p. 974-78.
20. Goyal D., Lane T., Panichas C., Chong K.M., Villalobos O. Failure mechanism of brittle solder joint fracture in the presence of electoless nickel immersion gold interface. 2002;ECTC. p. 732-39.
21. Schubert A., Dudek R., Leutenbauer R., Doring R., Kloeser J., Oppermann H., et al. Do chip size limits exists for DCA. IEEE Trans. Elec. Pack Manuf. 22:1999;255-261.