Digital image correlation analysis of the deformation behavior of Pb-free solders at intermediate strain rates

JOM

Volumn 62, Issue 7, 2010, Pages 16-21

  Yazzie, K E ^a   Williams, J J ^a   Kingsbury, D ^a   Peralta, P ^a   Jiang, H ^a   Chawla, N ^a  

^a Arizona State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPLIED STRAIN; DEFORMATION BEHAVIOR; DIGITAL IMAGE CORRELATIONS; ENVIRONMENTALLY BENIGN; EXPERIMENTAL SETUP; INTERMEDIATE STRAIN RATE; LOCAL STRAINS; LOCAL STRESS; MECHANICAL SHOCK; NUMERICAL MODELS; PARAMETRIC STUDY; PB FREE SOLDERS; PORTABLE ELECTRONICS; QUASI-STATIC; RATE BEHAVIOR; SN-3.5AG; SOLDER INTERCONNECTS; TENSILE TESTS;

ELASTICITY; IMAGE ANALYSIS; LEAD; SILVER; SOLDERING ALLOYS; STRAIN MEASUREMENT; STRUCTURAL DESIGN; TENSILE TESTING; TIN;

STRAIN RATE;

EID: 77956897780     PISSN: 10474838     EISSN: 15431851     Source Type: Journal    
DOI: 10.1007/s11837-010-0102-y     Document Type: Article

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