Mechanical properties of Cu6Sn5 intermetallic by micropillar compression testing

Scripta Materialia

Volumn 63, Issue 5, 2010, Pages 480-483

  Jiang, L ^a   Chawla, N ^a  

^a Arizona State University   (United States)

Author keywords

Cu6Sn5; Focused ion beam; Lead free solder; Micropillar compression

Indexed keywords

FOCUSED ION BEAM MILLING; FRACTOGRAPHIC ANALYSIS; FRACTURE STRESS; LEAD FREE SOLDERS; LEAD-FREE SOLDER; MICRO PILLARS; MICROCOMPRESSION; MICROMECHANICAL BEHAVIOR; NANOINDENTERS; STRESS-STRAIN BEHAVIORS; TAPER ANGLES;

BEAM PLASMA INTERACTIONS; COMPRESSION TESTING; FOCUSED ION BEAMS; FRACTURE; ION BOMBARDMENT; IONS; LEAD; MECHANICAL PROPERTIES; OPTICAL COMMUNICATION; STRESS-STRAIN CURVES;

TIN;

EID: 77953684977     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2010.05.009     Document Type: Article

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