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Journal of Alloys and Compounds

Volumn 509, Issue 23, 2011, Pages 6666-6672

Evolution of Ag3Sn at Sn-3.0Ag-0.3Cu-0.05Cr/Cu joint interfaces during thermal aging

(5) Lin, Fei a Bi, Wenzhen a Ju, Guokui a Wang, Wurong a Wei, Xicheng a,b

a SHANGHAI UNIVERSITY (China)

b BEIJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS (China)

Author keywords

Ag3Sn; Aging; Intermetallic compounds (IMC); Sn 3.0Ag 0.3Cu 0.05Cr Cu joint

Indexed keywords

AG3SN; AGING; BONDING PROPERTY; CR ADDITION; ENERGY MINIMIZATION; IMC LAYER; INTERFACIAL DIFFUSION; INTERMETALLIC COMPOUNDS; ISOTHERMAL AGING; JOINT INTERFACES; MORPHOLOGICAL EVOLUTION; ROD-SHAPED; SMALL PARTICLES; SN-3.0AG-0.3CU-0.05CR/CU JOINT; SN-3.0AG-0.5CU;

INTERMETALLICS; MORPHOLOGY; PHASE INTERFACES; SOLDERING; SOLDERING ALLOYS; THERMAL AGING; TIN;

SILVER;

EID: 79955784010 PISSN: 09258388 EISSN: None Source Type: Journal
DOI: 10.1016/j.jallcom.2011.03.134 Document Type: Article

Times cited : (41)

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