Interfacial reactions on Pb-free solders with Au/Pd/Ni/Cu multilayer substrates

Journal of Alloys and Compounds

Volumn 503, Issue 1, 2010, Pages 25-30

  Yen, Yee Wen ^a   Tsai, Po Hao ^a   Fang, Yang Kai ^a   Lo, Shao Cheng ^a   Hsieh, Yu Ping ^a   Lee, Chiapyng ^a  

^a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Activation energy; Au Pd Ni Cu multilayer substrate; Diffusion controlled; Interfacial reaction; Lead free solder

Indexed keywords

INTERFACIAL REACTION; INTERFACIAL REACTIONS; LEAD FREE SOLDERS; MULTILAYER SUBSTRATE; PB FREE SOLDERS; REACTION MECHANISM; REACTION SYSTEM; REACTION TIME; SN-3.0AG-0.5CU;

ACTIVATION ENERGY; DIFFUSION; LEAD; MULTILAYERS; PALLADIUM; PHASE INTERFACES; SILVER; SOLDERED JOINTS; SOLDERING ALLOYS; SUBSTRATES; ZINC;

TIN;

EID: 77955305292     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2010.04.241     Document Type: Article

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