Nano-conductive adhesives for nano-electronics interconnection

Nano-Bio- Electronic, Photonic and MEMS Packaging

Volumn , Issue , 2010, Pages 19-45

  Li, Yi ^a   Moon, Kyoung Sik ^b   Wong, C P ^b  

^a INTEL CORPORATION   (United States)

^b Georgia Institute of Technology   (United States)

Author keywords

Anisotropic conductive adhesives (ACAs); Carbon nanotubes (CNT); Current carrying capability; Electrically conductive adhesives (ECAs); Fine pitch interconnection; Isotropically conductive adhesives (ICA); Nanoconductive fillers; Nanotechnology; Percolation threshold; Self assembled monolayer (SAM); Sintering; Thermo compression bonding (TCB); Transparent electrodes

Indexed keywords

EID: 80855136869     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1007/978-1-4419-0040-1_2     Document Type: Chapter

References (103)

1. Wolfson H. and Elliot G., Electrically conducting cements containing epoxy resins and silver. US Patent 2, 774, 747, 1956.
2. Matz K.R., Electrically conductive cement and brush shunt containing the same. US Patent 2, 849, 631, 1958.
3. Beck D.P., Printed electrical resistors. US Patent 2, 866, 057, 1958.
4. Li Y., Moon K., and Wong C.P., Science 2005; 308: 1419-1420.
5. Li Y. and Wong C.P., Mater. Sci. Eng. R 2006; 51: 1-35.
6. Liu J., (Ed.), Conductive adhesives for Electronics Packaging. Electrochemical Publications Ltd., Port Erin, Isle of Man, 1999; Chapter 1.
7. Hwang J.S. (Ed.), Environment-Friendly Electronics: Lead-free Technology. Electrochemical Publications Ltd., Port Erin, Isle of Man, 2001; Chapter 1, pp. 4-10.
8. Murray C.T., Rudman R.L., Sabade M.B., and Pocius A.V., Mater. Res. Bull. 2003; 28: 449-454.
9. Lau J., Wong C.P., Lee N.C., and Lee S.W.R., In: Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials. McGraw-Hill, New York, 2002.
10. Lu D., Tong Q.K., and Wong C.P., IEEE Trans. Compon. Packag. Manuf. Technol., Part C 1999; 22(3): 228-232.
11. Persson K., Nylund A., Liu J., and Olefjord I., Proceedings of the 7th European Conference on Applications of Surface and Interface Analysis, Gothenburg, June 1997.
12. Lu D. and Wong C.P., J. Appl. Polym. Sci. 1999; 74: 399-406.
13. Li Y., Moon K., and Wong C.P., J. Adhes. Sci. Technol. 2005; 19(16): 1427-1444.
14. Matienzo L.J., Egitto F.D., and Logan P.E., J. Mater. Sci. 2003; 38: 4831-4842.
15. Li H., Moon K., and Wong C.P., J. Electron. Mater. 2004; 33: 106-113.
16. Lu D., Tong Q.K., and Wong C.P., IEEE Trans. Compon. Packag. Manuf. Technol. Part C 1999; 22: 223-227.
17. Li Y., Moon K., andWong C.P., IEEE Trans. Compon. Packag.Manuf. Technol. 2006; 29(1): 173-178.
18. Li Y., Moon K., Whitman A., and Wong C.P., IEEE Trans. Compon. Packag. Manuf. Technol. 2006; 29(4): 758-763.
19. Gallagher C., Matijasevic G., and Maguire J.F., Proceedings of 47th IEEE Electronic Components and Technology Conference 1997; 554-560.
20. Roman J.W. and Eagar T.W., Proceedings of the International Society for Hybrids and Microelectronics Society, San Francisco, CA, 1992; 52.
21. Li Y., Moon K., Li H., and Wong C.P., Proceedings of 54th IEEE Electronic Components and Technology Conference, Las Vegas, Nevada, June 1-4, 2004; 1959-1964.
22. Cavasin D., Brice-Heams K., and Arab A. Proceedings of 53rd Electronic Components and Technology Conference 2003; 1404-1407.
23. Kisiel R., J. Electron. Packag. 2002; 124: 367.
24. de Vries H., van Delft J., and Slob K., IEEE Trans. Compon. Packag.Manuf. Technol. 2005; 28: 499.
25. Watanabe I., Gotoh Y., and Kobayashi K. Proc. Asia Display/IDW, Nagoya, Japan 2001; 553-556.
26. Nishida H., Sakamoto K., and Ogawa H., IBM J. Res. Dev. 1998; 42: 517.
27. Williams D.J., Whalley D.C., Boyle O.A., and Ogunjimi A.O., Solder. Surf. Mount Tech. 1993; 5: 4.
28. Liu J., Tolvgard A., Malmodin J., and Lai Z., IEEE Trans. Compon. Packag.Manuf. Technol. 1999; 22: 186.
29. Clot P., Zeberli J.F., Chenuz J.M., Ferrando F., and Styblo D., Proceedings of the International Electronics Manufacturing Technology Symposium 24th IEEE/CPMT, Austin, TX, 1999; 36.
30. Wu H., Wu X., Liu J., Zhang G., Wang Y., Zeng Y., and Jing J., Development of a novel isotropic conductive adhesive filled with silver nanowires. J. Compos. Mater. 2006; 40(21): 1961-1968.
31. Chen C., Wang L., Li R., Jiang G., Yu H., and Chen T., J. Mater. Sci. 2007; 42(9): 3172.
32. Lee H.S., Chou K.S., and Shih Z.W., Effect of nano-sized silver particles on the resistivity of polymeric conductive adhesives. Int. J. Adhes. Adhes. 2005; 25: 437-441.
33. Ye L., Lai Z., Liu J., and Tholen A., Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives. IEEE Trans. Electron. Packag. Manuf. 1999; 22(4): 299-302.
34. Fan L., Su B., Qu J., and Wong C.P., Electrical and thermal conductivities of polymer composites containing nano-sized particles. Proceedings of Electronic Components and Technology Conference. IEEE, NJ, 2004; 148-154.
35. Jiang H.J., Moon K., Lu J., and Wong C.P., J. Electron. Mater. 2005; 34: 1432-1439.
36. Jiang H.J., Moon K., Li Y., and Wong C.P., Surface functionalized silver nanoparticles for ultrahigh conductive polymer composites. Chem. Mater. 2006; 18(13): 2969-2973.
37. Kotthaus S., Günther B.H., Haug R., and Schafer H., Study of isotropically conductive bondings filled with aggregates of nano-sized Ag-particles. IEEE Trans. Compon. Packag.Manuf. Technol. Part A 1997; 20(1): 15-20.
38. Das R.N., Lauffer J.M., and Egitto F.D., Proceedings of Electronic Components and Technology Conference. IEEE, 2006; 112-118.
39. Iijima S., Nature 1991; 354: 56.
40. Berber S., Kwon Y.K., and Tomànek D., Unusually high thermal conductivity of carbon nanotubes. Phys. Rev. Lett. 2000; 84(20): 4613-4616.
41. Yu M.F., Files B.S., Arepalli S., and Ruoff R.S., Tensile loading of ropes of single wall carbon nanotubes and their mechanical properties. Phys. Rev. Lett. 2000; 84(24): 5552-5555.
42. Li J. and Lumpp J.K., Electrical and mechanical characterization of carbon nanotube filled conductive adhesive. In: Proceedings of Aerospace Conference. IEEE, NJ, 2006; 1-6.
43. Qian D., Dickey E.C., Andrews R., and Rantell T., Load transfer and deformation mechanisms in carbon nanotube polystyrene composites. Appl. Phys. Lett. 2000; 76: 2868.
44. Lin X.C. and Lin F., Improvement on the properties of silver-containing conductive adhesives by the addition of carbon nanotube. In: Proceedings of High Density Microsystem Design and Packaging. IEEE, NJ, 2004; 382-384.
45. Rutkofsky M., Banash M., Rajagopal R., and Chen J., Using a carbon nanotube additive to make electrically conductive commercial polymer composites. Zyvex Corporation Application Note 9709: http://www.zyvex.com/Documents/9709. PDF28;2006.
46. Kamyshny A., Ben-Moshe M., Aviezer S., and Magdassi S., Ink-jet printing of metallic nanoparticles and microemulsions. Macromol. Rapid Commun. 2005; 26: 281-288.
47. Cibis D. and Currle U., Inkjet printing of conductive silver paths. In: 2nd International Workshop on Inkjet Printing of Functional Polymers and Materials. Eindhoven, The Netherlands, 2005.
48. Kolbe J., Arp A., Calderone F., Meyer E.M., Meyer W., Schaefer H., and Stuve M., Inkjettable conductive adhesive for use in microelectronics and microsystems technology. In: Proceedings of IEEE Polytronic Conference. IEEE, NJ, 2005; 1-4.
49. Moscicki A., Felba J., Sobierajski T., Kudzia J., Arp A., and Meyer W., Electrically conductive formulations filled nano size silver filler for ink-jet technology. In: Proceedings of IEEE Polytronic Conference. IEEE, NJ, 2005; 40-44.
50. Wakuda D., Hatamura M., and Suganuma K., Chem. Phys. Lett. 2007; 441: 305-308.
51. Moon K., Dong H., Maric R., Pothukuchi S., Hunt A., Li Y., and Wong C.P., J. Electron. Mater. 2005; 34: 132-139.
52. Matsuba Y., Erekutoronikusu Jisso Gakkaishi 2003; 6(2): 130-135.
53. Li Y., Moon K. and Wong C.P., J. Appl. Polym. Sci. 2006; 99(4): 1665-1673.
54. Li Y., Moon K., and Wong C.P. In: Proceedings of 54th IEEE Electronic Components and Technology Conference. IEEE, NJ, 2004; 1968-1974.
55. Li Y. and Wong C.P. In: Proceedings of 55th IEEE Electronic Components and Technology Conference. IEEE, NJ, 2005; 1147-1154.
56. Li Y., Moon K., and Wong C.P., J. Electron. Mater. 2005; 34(3): 266-271.
57. Li Y., Moon K., and Wong C.P., J. Electron. Mater. 2006; 34(12): 1573-1578.
58. Davies G. and Sandstrom J. Circuits Manuf. 1976; 56-62.
59. Harsanyi G. and Ripka G., Electrocomp. Sci. Technol. 1985; 11: 281-290.
60. Giacomo G.A., In: J. McHardy and F. Ludwig (Eds.) Electrochemistry of Semiconductors and Electronics: Processes and Devices. Noyes Publications, Park Ridge, NJ, 1992; pp. 255-295.
61. Manepalli R., Stepniak F., Bidstrup-Allen S.A., and Kohl P.A., IEEE Trans. Adv. Packag. 1999; 22: 4-8.
62. Giacomo D., In: Reliability of Electronic Packages and Semiconductor Devices. McGraw- Hill, New York, 1997; Chapter 9.
63. Wassink R., Hybrid. Circ. 1987; 13: 9-13.
64. Shirai Y., Komagata M., and Suzuki K. In: 1st International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. IEEE, NJ, 2001; 79-83.
65. Der Marderosian A. Ratheon Co. Equipment Division, Equipment Development Laboratories 1978; 134-141.
66. Schonhorn H. and Sharpe L.H., Prevention of surface mass migration by a polymeric surface coating. US Patent 4377619, 1983.
67. Brusic V., Frankel G.S., Roldan J., and Saraf R., J. Electrochem. Soc. 1995; 142: 2591-2594.
68. Wang P.I., Lu T.M., Murarka S.P., and Ghoshal R., US Pending Patent 20050236711, 2005.
69. Li Y. and Wong C.P. US Patent Pending, 2006.
70. Li Y. and Wong C.P., Monolayer-protection for eletrochemical migration control in silver nanocomposite. Appl. Phys. Lett. 2006; 81: 112112.
71. Prinz G.A., Science 1998; 282: 1660.
72. Toshioka H., Kobayashi M., Koyama K., Nakatsugi K., Kuwabara T., Yamamoto M., and Kashihara H., SEI Tech. Rev. 2006; 62: 58-61.
73. Chang D.C. and Smith E.L., US patent #5206585, 1993.
74. Lieber C.M., Nanowire nanosensors for high sensitive and selective detection of biological and chemical species. Science 2001; 293: 1289-1292.
75. Martin C.R. and Menon V.P., Fabrication and evaluation of nanoelectrode ensembles. Anal. Chem 1995; 67: 1920-1928.
76. Xu J.M., Appl. Phys. Lett. 2001; 79: 1039-1041.
77. Russell T.P., Ultra-high density nanowire array grown in self-assembled di-block copolymer template. Science 2000; 290: 2126-2129.
78. Li Y., Moon K., and Wong C.P., In: Proceedings of 56th IEEE Electronic Components and Technology Conference. IEEE, NJ, 2006; 1239-1245.
79. Li Y., Zhang Z., Moon K., and Wong C.P., Ultra-fine pitch wafer level ACF (anisotropic conductive film) interconnect by in-situ formation of nano fillers with high current carrying capability. US Patent Pending, 2006.
80. Moon K., Jiang H., Zhang R., and Wong C., In-situ formed nanoparticles in polymer matrix for low pressure bonding, GTRC Invention Disclosure No. 4443, 2008.
81. Snow E.S., Novak J.P., Lay M.D., Houser E.H., Perkins F.K., and Campbell P.M., J. Vac. Sci. Technol. B 2004; 22(4): 1990.
82. Lay M.D., Novak J.P., and Snow E.S., Nano Lett. 2004; 4(4): 603.
83. Shiraishi M., Takenobu T., Iwai T., Iwasa Y., Kataura H., and Ata M., Chem. Phys. Lett. 2004; 394: 110.
84. Meitl M.A., Zhou Y., Gaur A., Jeon S., Usrey M.L., Strano M.S., and Rogers J.A., Nano Lett. 2004; 4(9): 1643.
85. Zhou Y., Gaur A., Hur S., Kocabas C., Meitl M.A., Shim M., and Rogers J.A., Nano Lett. 2004; 4(10): 2031.
86. Li Z., Dharap P., Nagarajaiah S., Barrera E.V., and Kim J.D., J. Adv. Mat. 2004; 16: 640.
87. Abraham J.K., Philip B., Witchurch A., Varadan V.K., and Reddy C.C., Smart Mater. Struct. 2004; 1045: 13.
88. Wu Z., Chen Z., Du X., Logan J.M., Sippel J., Nikolou M., Kamaras K., Reynolds J.R., Tanner D.B., Hebard A.F., and Rinzler A.G., Science 2004; 305: 1273.
89. Ferrer-Anglada N., Kaempgen M., Skákalová V., Dettlaf-Weglikowska U., and Roth S., Diam. Relat. Mater. 2004; 13(2): 256.
90. Hu L., Zhoa Y-L., Ryu K., Zhou C., Stoddart J.F., and Grüner G. Advanced Materials 2008; 20: 5939-5946.
91. Gruner G., J. Mater. Chem. 2006; 16: 3533-3539.
92. Ago H., Petritsch K., Shaffer M.S.P., Windle A.H., and Friend R.H., Adv. Mater. 1999; 11: 1281.
93. Du Pasquier A., Unalan H.E., Kanwal A., Miller S., and Chhowalla M., Appl. Phys. Lett. 2005; 87: 203511.
94. Shan B. and Cho K., Phys. Rev. Lett. 2005; 94: 236602.
95. Mitschke U. and Bauerle P., J. Mater. Chem. 2000; 10: 1471.
96. Kaempgen M., Duesberg G.S., and Roth S., Appl. Surf. Sci. 2005; 252: 425-429.
97. Kaiser A.B., Dusberg G., and Roth S., Phys. Rev. B 1998; 57: 1418.
98. Liu K., Roth S., Duesberg G.S., Kim G.-T., and Schmid M., Progress in Molecular Nanostructures, H. Kuzmany, J. Fink, M. Mehring, S. Roth (Eds.). American Institute of Physics, New York, 1998; AIP Conference Proceedings 442, 61-64.
99. Shirashi M., Synth. Met. 2002; 9198: 1.
100. Duesberg G.S., Graham A.P., Kreupl F., Liebau M., Seidel R., Under E., and Hönlein W., Diam. Rel. Mater. 2004; 13: 354.
101. Lu K.L., Lago R.M., Chen Y.K., Green M.L.H., Harris P.J.E., and Tsang S.C., Carbon 1996; 34: 814.
102. Trancik J.E., Barton S.C., and Hone J., Nano Lett. 2008; 8(4): 982-987.
103. Ouyang H.Y. and Yang Y., Adv. Mater. 2006; 18: 2141-2144.