Packaging technologies using anisotropic conductive adhesive films in FPDs

SID Conference Record of the International Display Research Conference

Volumn , Issue , 2001, Pages 553-556

  Watanabe, Itsuo ^a   Gotoh, Yasushi ^a   Kobayashi, Kouji ^a  

^a Showa Denko Materials Co   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ELECTRONICS PACKAGING; FLAT PANEL DISPLAYS; HARDNESS; LIQUID CRYSTAL DISPLAYS; PRINTED CIRCUIT BOARDS;

CONTACT RESISTANCE;

CONDUCTIVE FILMS;

EID: 0035782561     PISSN: 10831312     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Yamaguchi, Y., I. Tsukagoshi, and T. Ohm, Technical Report of IEICE, EMD92-69, 1992, pp.29-36.
2. Kawaguchi, H., K. Aota and M. Ohga, ISHM'95 Proceedings, pp.266-271, 1995.
3. Van Noort, H.M., M.J.H. Kloos, and H.E.A. Schafer, Adhesives in Electronics '94, 1994.
4. Watanabe, I.,K. Takemura, N. Shiozawa and T. Ohta, in John H. Lau, Flip Chip Technologies, Chapter 9, pp.301-315, MCGraw Hill, 1996.