Flip-chip on flex for 3D packaging

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1999, Pages 36-41

  Clot, Ph ^a   Zeberli, J F ^a   Chenuz, J M ^a   Ferrando, F ^a   Styblo, D ^a  

^a Valtronic SA   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP ON BOARD PROCESS; CHIP SCALE PACKAGE; NONCONDUCTIVE ADHESIVES;

ADHESIVES; FLIP CHIP DEVICES; PRINTED CIRCUIT BOARDS; SUBSTRATES;

ELECTRONICS PACKAGING;

EID: 0033335126     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)