-
1
-
-
80455167696
-
-
Available
-
Available: http://public.itrs.net/
-
-
-
-
2
-
-
4544367603
-
-
F. L. Yang, D. H. Lee, H. Y. Chen, et al., VLSI Symp. Tech. Dig., 2004, pp.196-197.
-
VLSI Symp. Tech. Dig., 2004
, pp. 196-197
-
-
Yang, F.L.1
Lee, D.H.2
Chen, H.Y.3
-
3
-
-
33847734326
-
-
S. D. Suk, S. -Y. Lee, S. -M. Kim, et al., IEDM Tech. Dig., 2005, pp. 717-720.
-
(2005)
IEDM Tech. Dig.
, pp. 717-720
-
-
Suk, S.D.1
Lee, S.-Y.2
Kim, S.-M.3
-
4
-
-
36148984226
-
-
N. Singh, F.Y. Lim, W.W. Fang, et al., IEDM Tech. Dig., 2006, pp. 547-550.
-
(2006)
IEDM Tech. Dig.
, pp. 547-550
-
-
Singh, N.1
Lim, F.Y.2
Fang, W.W.3
-
5
-
-
36549044824
-
-
K. H. Cho, S. D. Suk, Y. Y. Yeoh, et al., IEDM Tech. Dig., 2006, pp. 543-546.
-
(2006)
IEDM Tech. Dig.
, pp. 543-546
-
-
Cho, K.H.1
Suk, S.D.2
Yeoh, Y.Y.3
-
7
-
-
51949101127
-
-
Y. Jiang, T. Y. Liow, N. Singh, et al., VLSI Symp. Tech. Dig., 2008, pp.34-35.
-
VLSI Symp. Tech. Dig., 2008
, pp. 34-35
-
-
Jiang, Y.1
Liow, T.Y.2
Singh, N.3
-
8
-
-
80455165632
-
-
M. Li, K. H. Yeo, S. D. Suk, et al., VLSI Symp. Tech. Dig., 2009, pp.94-95.
-
VLSI Symp. Tech. Dig., 2009
, pp. 94-95
-
-
Li, M.1
Yeo, K.H.2
Suk, S.D.3
-
9
-
-
77954290340
-
-
S. Bangsaruntip, G. M. Cohen, A. Majumdar, et al., IEDM Tech. Dig., 2009, pp. 297-300.
-
(2009)
IEDM Tech. Dig.
, pp. 297-300
-
-
Bangsaruntip, S.1
Cohen, G.M.2
Majumdar, A.3
-
10
-
-
33846695595
-
-
E. Stern, J. F. Klemic, D. A, et al., Nature, vol. 445, pp. 519-522, 2007.
-
(2007)
Nature
, vol.445
, pp. 519-522
-
-
Stern, E.1
Klemic, J.F.2
A, D.3
-
11
-
-
34247846234
-
-
M. C. Mcalpine, H. Ahmad, D. Wang, et al., Nature Materials, vol. 6, pp. 379-384, 2007.
-
(2007)
Nature Materials
, vol.6
, pp. 379-384
-
-
Mcalpine, M.C.1
Ahmad, H.2
Wang, D.3
-
12
-
-
77955570694
-
-
J. -H. Ahn, S. -J. Choi, J. -W. Han, et al., Nano Letters, vol. 10, pp. 2934-2938, 2010.
-
(2010)
Nano Letters
, vol.10
, pp. 2934-2938
-
-
Ahn, J.-H.1
Choi, S.-J.2
Han, J.-W.3
-
13
-
-
35348984409
-
-
B. Tian, X. L. Zheng, et al., Nature, vol. 449, pp. 885-890, 2007.
-
(2007)
Nature
, vol.449
, pp. 885-890
-
-
Tian, B.1
Zheng, X.L.2
-
14
-
-
65249160760
-
-
V. Sivakov, G. Andrä, et al., Nano Letters, vol. 9, pp. 1549-1554, 2009.
-
(2009)
Nano Letters
, vol.9
, pp. 1549-1554
-
-
Sivakov, V.1
Andrä, G.2
-
15
-
-
51949092967
-
-
T. -Y. Liow, K. -M. Tan, R. T. P. Lee, et al., VLSI Symp. Tech. Dig., 2008, pp. 36-37.
-
VLSI Symp. Tech. Dig., 2008
, pp. 36-37
-
-
Liow, T.-Y.1
Tan, K.-M.2
Lee, R.T.P.3
-
16
-
-
77950297915
-
-
Y. K. Chin, K. L. Pey, N. Singh, et al., IEDM Tech. Dig., 2009, pp. 935-938.
-
(2009)
IEDM Tech. Dig.
, pp. 935-938
-
-
Chin, Y.K.1
Pey, K.L.2
Singh, N.3
-
17
-
-
67349106462
-
-
Apr.
-
P. Hashemi, L. Gomez, and J. L. Hoyt, IEEE Electron Device Lett., vol. 30, pp. 401-403, Apr. 2009.
-
(2009)
IEEE Electron Device Lett.
, vol.30
, pp. 401-403
-
-
Hashemi, P.1
Gomez, L.2
Hoyt, J.L.3
-
18
-
-
34447260751
-
-
Jul.
-
N. Singh, W. W. Fang, S. C. Rustagi, et al., IEEE Electron Device Lett., vol. 28, pp. 558-561, Jul. 2007.
-
(2007)
IEEE Electron Device Lett.
, vol.28
, pp. 558-561
-
-
Singh, N.1
Fang, W.W.2
Rustagi, S.C.3
-
19
-
-
56649103049
-
-
L. K. Bera, H. S. Nguyen, N. Singh, et al., IEDM Tech. Dig., 2006, pp. 551-554.
-
(2006)
IEDM Tech. Dig.
, pp. 551-554
-
-
Bera, L.K.1
Nguyen, H.S.2
Singh, N.3
-
20
-
-
66949164829
-
-
C. Dupré, A. Hubert, S. Bécu, et al., IEDM Tech. Dig., 2008, pp. 749-752.
-
(2008)
IEDM Tech. Dig.
, pp. 749-752
-
-
Dupré, C.1
Hubert, A.2
Bécu, S.3
-
21
-
-
67349225959
-
-
May
-
R. M. Y. Ng, T. Wang, F. Liu, et al., IEEE Electron Device Lett., vol. 30, pp. 520-522, May 2009.
-
(2009)
IEEE Electron Device Lett.
, vol.30
, pp. 520-522
-
-
Ng, R.M.Y.1
Wang, T.2
Liu, F.3
-
22
-
-
43549111947
-
-
S. D. Suk, K. H. Yeo, K. H. Cho, et al., VLSI Symp. Tech. Dig., 2007, pp.142-143.
-
VLSI Symp. Tech. Dig., 2007
, pp. 142-143
-
-
Suk, S.D.1
Yeo, K.H.2
Cho, K.H.3
-
24
-
-
77951878360
-
-
May
-
Y. Sun, H. Y. Yu, N. Singh, IEEE Electron Device Lett., vol. 31, pp. 390-392, May 2010.
-
(2010)
IEEE Electron Device Lett.
, vol.31
, pp. 390-392
-
-
Sun, Y.1
Yu, H.Y.2
Singh, N.3
-
25
-
-
77957913604
-
-
A. Hubert, E. Nowak, K. Tachi, et al., IEDM Tech. Dig., 2009, pp. 637-640.
-
(2009)
IEDM Tech. Dig.
, pp. 637-640
-
-
Hubert, A.1
Nowak, E.2
Tachi, K.3
-
26
-
-
77649180955
-
-
Mar.
-
P. -C. Huang, L. -A. Chen, and J. -T. Sheu, IEEE Electron Device Lett., vol. 31, pp. 216-218, Mar. 2010.
-
(2010)
IEEE Electron Device Lett.
, vol.31
, pp. 216-218
-
-
Huang, P.-C.1
Chen, L.-A.2
Sheu, J.-T.3
-
27
-
-
77957884572
-
-
S. Bangsaruntip, A. Majumdar, G. M. Cohen, et al., VLSI Symp. Tech. Dig., 2010, pp. 21-22.
-
VLSI Symp. Tech. Dig., 2010
, pp. 21-22
-
-
Bangsaruntip, S.1
Majumdar, A.2
Cohen, G.M.3
-
28
-
-
36148984654
-
-
Nov.
-
S. C. Rustagi, N. Singh, W. W. Fang, et al., IEEE Elec. Device Lett., vol. 28, pp. 1021-1024, Nov. 2007.
-
(2007)
IEEE Elec. Device Lett.
, vol.28
, pp. 1021-1024
-
-
Rustagi, S.C.1
Singh, N.2
Fang, W.W.3
-
31
-
-
79960808656
-
-
M. Saitoh, Y. Nakabayashi, K. Ota, et al., IEDM Tech. Dig., 2010, pp. 780-783.
-
(2010)
IEDM Tech. Dig.
, pp. 780-783
-
-
Saitoh, M.1
Nakabayashi, Y.2
Ota, K.3
-
34
-
-
70350639240
-
-
R. Wang, J. Zhuge, C. Liu, R. Huang, et al., IEDM Tech. Dig., 2008, pp. 753-756.
-
(2008)
IEDM Tech. Dig.
, pp. 753-756
-
-
Wang, R.1
Zhuge, J.2
Liu, C.3
Huang, R.4
-
38
-
-
51949118252
-
-
M. Guillorn, J. Chang, A. Bryant, et al., VLSI Symp. Tech. Dig., 2008, pp. 12-13.
-
VLSI Symp. Tech. Dig., 2008
, pp. 12-13
-
-
Guillorn, M.1
Chang, J.2
Bryant, A.3
-
39
-
-
49249139665
-
-
Aug.
-
J. Zhuge, R. Wang, R. Huang, X. Zhang, and Y. Y. Wang, IEEE Trans. Electron Devices, vol. 55, pp. 2142-2147, Aug. 2008.
-
(2008)
IEEE Trans. Electron Devices
, vol.55
, pp. 2142-2147
-
-
Zhuge, J.1
Wang, R.2
Huang, R.3
Zhang, X.4
Wang, Y.Y.5
-
40
-
-
34249901279
-
-
Jun.
-
J. -W. Yang, P. M. Zeitzoff, and H. -H. Tseng, IEEE Trans. Electron Devices, vol. 54, pp. 1464-1470, Jun. 2007.
-
(2007)
IEEE Trans. Electron Devices
, vol.54
, pp. 1464-1470
-
-
Yang, J.-W.1
Zeitzoff, P.M.2
Tseng, H.-H.3
-
41
-
-
12344311284
-
-
Jan.
-
V. Trivedi, J. G. Fossum, and M. M. Chowdhury, IEEE Trans. Electron Devices, vol. 52, pp. 56-62, Jan. 2005.
-
(2005)
IEEE Trans. Electron Devices
, vol.52
, pp. 56-62
-
-
Trivedi, V.1
Fossum, J.G.2
Chowdhury, M.M.3
-
42
-
-
58149505690
-
-
Jan.
-
J. Zhuge, R. Wang, R. Huang, Y. Tian, L. Zhang, D. -W. Kim, D. Park, and Y. Y. Wang, IEEE Electron Device Lett., vol. 30, pp. 57-60, Jan. 2009.
-
(2009)
IEEE Electron Device Lett.
, vol.30
, pp. 57-60
-
-
Zhuge, J.1
Wang, R.2
Huang, R.3
Tian, Y.4
Zhang, L.5
Kim, D.-W.6
Park, D.7
Wang, Y.Y.8
-
43
-
-
72049121195
-
-
Oct.
-
C. Wei, Y. Jiang, Y. -Z. Xiong, X. Zhou, N. Singh, S. C. Rustagi, G. Q. Lo, and D. -L. Kwong, IEEE Electron Device Lett., vol. 30, pp. 1081-1083, Oct. 2009.
-
(2009)
IEEE Electron Device Lett.
, vol.30
, pp. 1081-1083
-
-
Wei, C.1
Jiang, Y.2
Xiong, Y.-Z.3
Zhou, X.4
Singh, N.5
Rustagi, S.C.6
Lo, G.Q.7
Kwong, D.-L.8
-
44
-
-
79960276149
-
-
Nov.
-
B. H. Hong, L. Choi, Y. C. Jung, S. W. Hwang, et al., IEEE Trans. Nanotechnolgy, vol. 9, pp. 754-758, Nov. 2010.
-
(2010)
IEEE Trans. Nanotechnolgy
, vol.9
, pp. 754-758
-
-
Hong, B.H.1
Choi, L.2
Jung, Y.C.3
Hwang, S.W.4
-
45
-
-
77956029919
-
-
D. Jang, J. W. Lee, K. Tachi, L. Montes, T. Ernst, G. T. Kim, and G. Ghibaudo, Appl. Phys. Lett., vol. 97, pp. 073505(1-3), 2010.
-
(2010)
Appl. Phys. Lett.
, vol.97
-
-
Jang, D.1
Lee, J.W.2
Tachi, K.3
Montes, L.4
Ernst, T.5
Kim, G.T.6
Ghibaudo, G.7
-
46
-
-
0026144142
-
-
G. Ghibaudo, O. Roux, C. Nguyen-Duc, F. Balestra, and J. Brini, Phys. Stat. Sol. A, vol. 124, pp. 571-581, 1991.
-
(1991)
Phys. Stat. Sol. A
, vol.124
, pp. 571-581
-
-
Ghibaudo, G.1
Roux, O.2
Nguyen-Duc, C.3
Balestra, F.4
Brini, J.5
-
48
-
-
0035310696
-
-
Apr.
-
R. Kolarova, T. Skotnicki, and J. A. Chroboczek, Microelectron. Reliab. vol. 41, pp. 579-585, Apr. 2001.
-
(2001)
Microelectron. Reliab.
, vol.41
, pp. 579-585
-
-
Kolarova, R.1
Skotnicki, T.2
Chroboczek, J.A.3
-
49
-
-
2942700010
-
-
Jul.
-
M. Marin, Y. A. Allogo, M. de Murcia, P. Llinares, and J. C. Vildeuil, Microelectron. Reliab., vol. 44, pp. 1077-1085, Jul. 2004.
-
(2004)
Microelectron. Reliab.
, vol.44
, pp. 1077-1085
-
-
Marin, M.1
Allogo, Y.A.2
De Murcia, M.3
Llinares, P.4
Vildeuil, J.C.5
-
50
-
-
33846625337
-
-
Sep.
-
F. Crupi, B. Kaczer, R. Degraeve, et al., IEEE Trans. Electron Devices, vol. 53, pp. 2351-2357, Sep. 2006.
-
(2006)
IEEE Trans. Electron Devices
, vol.53
, pp. 2351-2357
-
-
Crupi, F.1
Kaczer, B.2
Degraeve, R.3
-
52
-
-
0035310019
-
-
Apr.
-
W. Jin, W. Liu, S.K.H. Fung, P.C.H. Chan, and C. Hu, IEEE Trans. Electron Devices, vol. 48, pp. 730-736, Apr. 2001.
-
(2001)
IEEE Trans. Electron Devices
, vol.48
, pp. 730-736
-
-
Jin, W.1
Liu, W.2
Fung, S.K.H.3
Chan, P.C.H.4
Hu, C.5
-
53
-
-
33846111341
-
-
G. Guegan, R. Gwoziecki, O. Gonnard, G. Gouget, C.e Raynaud, M. Casse and S. Deleonibus, Mater. Res. Soc. Symp. Proc, vol. 913, 0913-D03-02, 2006.
-
(2006)
Mater. Res. Soc. Symp. Proc
, vol.913
-
-
Guegan, G.1
Gwoziecki, R.2
Gonnard, O.3
Gouget, G.4
Raynaud, C.E.5
Casse, M.6
Deleonibus, S.7
-
54
-
-
0030379801
-
-
Dec.
-
B.M. Tenbroek, G. Whiting, M.S.L. Lee and C.F. Edwards, IEEE Trans. Electron Devices, vol. 43, pp. 2240-2248, Dec. 1996.
-
(1996)
IEEE Trans. Electron Devices
, vol.43
, pp. 2240-2248
-
-
Tenbroek, B.M.1
Whiting, G.2
Lee, M.S.L.3
Edwards, C.F.4
-
55
-
-
79960837761
-
-
to be published, Aug.
-
R. Wang, J. Zhuge, R. Huang, et al., IEEE Trans. Electron Devices, vol. 58, no. 8, to be published, Aug. 2011.
-
(2011)
IEEE Trans. Electron Devices
, vol.58
, Issue.8
-
-
Wang, R.1
Zhuge, J.2
Huang, R.3
-
56
-
-
78049307956
-
-
Nov.
-
T. Yu, R. Wang, R. Huang, et al., IEEE Trans. Electron Devices, vol. 57, pp. 2864-2871, Nov. 2010.
-
(2010)
IEEE Trans. Electron Devices
, vol.57
, pp. 2864-2871
-
-
Yu, T.1
Wang, R.2
Huang, R.3
-
57
-
-
67650127116
-
-
Jul.
-
N. Seoane, A. Martinez, A. R. Brown, et al., IEEE Trans. Electron Devices, vol. 56, pp. 1388-1395, Jul. 2009.
-
(2009)
IEEE Trans. Electron Devices
, vol.56
, pp. 1388-1395
-
-
Seoane, N.1
Martinez, A.2
Brown, A.R.3
-
59
-
-
77955447291
-
-
Synopsys, Mountain View, CA
-
Sentaurus TCAD Tools, Synopsys, Mountain View, CA.
-
Sentaurus TCAD Tools
-
-
-
60
-
-
80455165628
-
-
to be published, Apr.
-
R. Wang, T. Yu, R. Huang, et al., Jpn. J. Appl. Phys., vol. 50, no. 4, to be published, Apr. 2011.
-
(2011)
Jpn. J. Appl. Phys.
, vol.50
, Issue.4
-
-
Wang, R.1
Yu, T.2
Huang, R.3
-
61
-
-
80455156577
-
-
R. Wang, T. Yu, R. Huang, et al., IEDM Tech. Dig., 2010, pp. 792-795.
-
(2010)
IEDM Tech. Dig.
, pp. 792-795
-
-
Wang, R.1
Yu, T.2
Huang, R.3
-
63
-
-
78049233898
-
-
J. Zhuge, R. Wang, R. Huang, et al., IEDM Tech. Dig., 2009, pp. 61-64.
-
(2009)
IEDM Tech. Dig.
, pp. 61-64
-
-
Zhuge, J.1
Wang, R.2
Huang, R.3
-
64
-
-
67349222904
-
-
S. O'uchi, T. Matsukawa, T. Nakagawa, et al., IEDM Tech. Dig., 2008, pp.709-712.
-
(2008)
IEDM Tech. Dig.
, pp. 709-712
-
-
O'uchi, S.1
Matsukawa, T.2
Nakagawa, T.3
-
65
-
-
3943073828
-
-
Aug.
-
D. Jiménez, B. Iniguez, J. Sune, et al., IEEE Electron Device Lett., vol. 25, pp. 571-573, Aug. 2004.
-
(2004)
IEEE Electron Device Lett.
, vol.25
, pp. 571-573
-
-
Jiménez, D.1
Iniguez, B.2
Sune, J.3
-
66
-
-
56549087011
-
-
Nov.
-
R. Wang, H. Liu. R. Huang, et al., IEEE Trans. Electron Devices, vol. 55, pp.2960-2967, Nov. 2008.
-
(2008)
IEEE Trans. Electron Devices
, vol.55
, pp. 2960-2967
-
-
Wang, R.1
Liu, H.2
Huang, R.3
-
68
-
-
79955812701
-
-
to be published, May
-
K. Kuhn, Sci China Inf. Sci, vol. 54, no. 5, pp. 936-945, to be published, May 2011.
-
(2011)
Sci China Inf. Sci
, vol.54
, Issue.5
, pp. 936-945
-
-
Kuhn, K.1
-
69
-
-
80455156575
-
-
Predictive Technology Model (PTM): http://ptm.asu.edu/.
-
-
-
-
71
-
-
70350639239
-
-
L. Zhang, R. Wang, J. Zhuge, R. Huang, et al., IEDM Tech. Dig., 2008, pp. 123-126.
-
(2008)
IEDM Tech. Dig.
, pp. 123-126
-
-
Zhang, L.1
Wang, R.2
Zhuge, J.3
Huang, R.4
-
72
-
-
78650015807
-
-
Dec.
-
C. Liu, T. Yu, R. Wang, L. Zhang, R. Huang, et al., IEEE Trans. Electron Devices, vol. 57, pp. 3442-3450, Dec. 2010.
-
(2010)
IEEE Trans. Electron Devices
, vol.57
, pp. 3442-3450
-
-
Liu, C.1
Yu, T.2
Wang, R.3
Zhang, L.4
Huang, R.5
-
73
-
-
80455167682
-
-
Y.Y. Yeoh, S.D. Suk, M. Li, et al., Proc. IEEE IRPS, 2009, pp. 400-404.
-
Proc. IEEE IRPS, 2009
, pp. 400-404
-
-
Yeoh, Y.Y.1
Suk, S.D.2
Li, M.3
-
74
-
-
56549091199
-
-
Nov.
-
T. Irisawa, T. Numata, E. Toyoda, et al., IEEE Trans. Electron Devices, vol. 55, pp. 3159-3166, Nov. 2008.
-
(2008)
IEEE Trans. Electron Devices
, vol.55
, pp. 3159-3166
-
-
Irisawa, T.1
Numata, T.2
Toyoda, E.3
-
75
-
-
34547885491
-
-
May
-
H. Ohta, et al., Jpn. J. Appl. Phys., vol. 46, pp. 3277-3282, May 2007.
-
(2007)
Jpn. J. Appl. Phys.
, vol.46
, pp. 3277-3282
-
-
Ohta, H.1
-
77
-
-
78650001676
-
-
G. Groeseneken, R. Degraeve, B. Kaczer, and K. Martens, Proc. ESSDERC, 2010, pp. 64-72.
-
Proc. ESSDERC, 2010
, pp. 64-72
-
-
Groeseneken, G.1
Degraeve, R.2
Kaczer, B.3
Martens, K.4
-
78
-
-
71049129897
-
-
L. Zhang, J. Zhuge, R. Wang, R. Huang, et al., VLSI Symp. Tech. Dig., 2009, pp. 46-47.
-
VLSI Symp. Tech. Dig., 2009
, pp. 46-47
-
-
Zhang, L.1
Zhuge, J.2
Wang, R.3
Huang, R.4
|