Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling

Microelectronics Reliability

Volumn 51, Issue 2, 2011, Pages 406-415

  Agyakwa, P A ^a   Corfield, M R ^a   Yang, L ^a   Li, J F ^a   Marques, V M F ^b   Johnson, C M ^a  

^a UNIVERSITY OF NOTTINGHAM   (United Kingdom)

^b UNIVERSITY OF OXFORD   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINIUM WIRES; BOND DEGRADATION; ELEVATED TEMPERATURE; EVOLUTION OF THE MICROSTRUCTURE; EXTENDED RANGE; HIGH PURITY; HIGH-T; INDENTATION HARDNESS; MAXIMUM TEMPERATURE; MICRO-STRUCTURAL; PURE AL; SHEAR TESTING; THERMO-MECHANICAL; WIRE BONDS;

ALUMINUM; HARDNESS TESTING; THERMAL CYCLING; ULTRASONICS;

WIRE;

EID: 79551494439     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2010.08.018     Document Type: Conference Paper

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