Impact of thermal overload operation on wirebond and metallization reliability in smart power devices

ESSCIRC 2004 - Proceedings of the 34th European Solid-State Device Research Conference

Volumn , Issue , 2004, Pages 273-276

  Glavanovics, Michael ^a   Detzel, Thomas ^a   Weber, Karin ^a  

^a INFINEON TECHNOLOGIES AUSTRIA AG   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

DEVICE FAILURE; OVERLOADS; POWER DEVICES; POWER DISSIPATION;

ELECTRIC CURRENTS; METALLIZING; MICROPROCESSOR CHIPS; SEMICONDUCTOR MATERIALS; STATISTICAL METHODS; SWITCHES; THERMAL STRESS;

THERMAL LOAD;

EID: 17644402837     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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