Lifetime extrapolation for IGBT modules under realistic operation conditions

Microelectronics Reliability

Volumn 39, Issue 6-7, 1999, Pages 1131-1136

  Ciappa, M ^a   Malberti, P ^a   Fichtner, W ^a   Cova, P ^b   Cattani, L ^b   Fantini, F ^b  

^a ETH ZURICH   (Switzerland)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

EXTRAPOLATION; FAILURE ANALYSIS; GATES (TRANSISTOR); INTEGRAL EQUATIONS; INTEGRATION; PROBABILITY; REDUNDANCY; RELIABILITY; SEMICONDUCTOR DEVICE MODELS; THERMAL EFFECTS;

BOND WIRE; FREQUENCY DISTRIBUTION; INSULATED GATE BIPOLAR TRANSISTOR MODULES; LIFETIME EXTRAPOLATION;

BIPOLAR TRANSISTORS;

EID: 0033147259     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(99)00160-2     Document Type: Article

References (7)

1. P. Cova, M. Ciappa, G. Franceschini, P. Malberti, F. Fantini Thermal characterization of IGBT power modules Microel. Reliab. 37(1997)1731-1734
2. H. Berg, E. Wolfgang Advanced IGBT modules for railway traction applications: reliability testing Microel. Reliab. 38(1998)1319-1323
3. P. Cova, F. Fantini On the effect of power cycling stress on IGBT modules Microel. Reliab. 38(1998)1347-1352
4. S. Dewar, G. Debled, E. Herr A 1200 A, 3300 VIGBT power module for traction applications PCIM, Nürnberg 1998
5. A. Hamidi, G. Coquery, R. Lallemand, P. Vales Temperature measurements and thermal modeling of high-power IGBT modules Microel. Reliab. 38(1998)1354-1359
6. P. Joerg Messung von Lokfahrten zur Ermittlung von realistischen Lastspielen ABB Technical Note 11/97, 1997
7. M. Ciappa, P. Malberti Plastic Strain of Aluminum Bond Wires in IGBT Multichip Modules under Thermal Cycling Quality and Reliab. Engin. Int. 12(1996)297-303