Mechanical fatigue properties of heavy aluminium wire bonds for power applications

Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC

Volumn , Issue , 2008, Pages 1363-1367

  Merkle, L ^a   Kaden, T ^a   Sonner, M ^a   Gademann, A ^a   Turki, J ^a   Dresbach, C ^b   Petzold, M ^b  

^a ROBERT BOSCH GMBH   (Germany)

^b FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; DURABILITY; EXPERIMENTS; EXTRACTION; FATIGUE TESTING; FINITE ELEMENT METHOD; GEOMETRY; LIGHT METALS; MECHANICAL PROPERTIES; TENSILE TESTING; THREE DIMENSIONAL;

ALUMINIUM WIRES; BONDED WIRES; BONDING GEOMETRIES; BONDING PROCESSES; BONDING WIRES; CROSS SECTIONS; EQUIVALENT STRAINS; EXPERIMENTAL TESTING; FATIGUE LOADINGS; FINITE ELEMENT MODELS; LIFE TIMES; LINEAR DEPENDENCIES; LOCAL DEFORMATIONS; MATERIAL PROPERTIES; MECHANICAL FATIGUE TESTING; MECHANICAL FATIGUES; METHODICAL APPROACHES; NUMBER OF CYCLES; NUMBER OF CYCLES TO FAILURES; POWER APPLICATIONS; ROOM TEMPERATURES; SIMULATION MODELS; SPHERICAL INDENTATIONS; TENSILE TESTS; TEST SET-UP; WIRE BONDS;

WIRE;

EID: 58149103466     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2008.4684554     Document Type: Conference Paper

References (14)

1. Harman, G., Wire Bonding in Microelectronics, Second Edition, McGraw-Hill (New York, 1996).
2. Hager, C., Lifetime estimation of aluminum wire bonds based on computational plasticity, Dissertation, ETH No. 13763, (Zurich, 2000).
3. Onuki, J., Koizumi. M, Suwa, M., "Reliability of thick Al wire bonds in IGBT modules for traction motor drives" IEEE Trans. Advanced Packaging, Vol. 1, No 1 (2000), pp. 108-112.
4. M. Ciappa, P. Malberti, W. Fichtner, P. Cova, L. Cattani, and F. Fantini, "Lifetime extrapolation for igbt modules under realistic operation conditions", Microelectronics and Reliability", Vol. 39, No. 6 (1999), pp. 1131-1136.
5. Held, M., Jacob, P., Nicoletti, G., Scacco, P., and Poech, M.-H., "Fast power cycling test for insulated gate bipolar transistor modules in traction application", Int. J. Electronics, Vol. 86, No. 10 (1999), pp. 1193-1204.
6. th EuPac, Essen, Germany, Jan. 1996, pp. 128-131.
7. Bielen, J., Gommans, J., Theunis, F., "Prediction of high cycle fatigue in aluminium bond wires: A physics of failure approach combining experiments and multi-physics simulations", Proc. EuroSime IEEE, Como, Italy, 2006, pp. 55-61.
8. Meyyappan, K. N., Failure Prediction of Wire Bonding Due to Flexure, Dissertation, Univ. of Maryland (Marryland, 2004).
9. Ramminger, S., Seeliger, N., Wachutka, G., "Reliability model for Al wire bonds subjected to heel crack failures", Microelectronics Reliability, Vol. 40 (2000), pp. 1521-1525.
10. Wilde, J., Schneider-Ramelow, M.; Petzold, M.; Scheel, W., Methoden zur Zuverlässigkeitsgualifizierung neuer Technologien in der Aufbau- und Verbindungstechnik: Herausforderungen und Möglichkeiten, Detert, (Templin/Uckermark 2006).
11. Lefranc, G., Weiss, B., Klos, C., Dick, J., Khatibi, G., Berg, H., "Aluminium bond-wire properties after 1 billion mechanical cycles", Microelectronics Reliability Vol. 43 (2003), pp. 1833-1838.
12. th International Fatigue Congress, Atlanta, USA, June, 2006.
13. Langenecker, B., "Effects of ultrasound on deformation characteristics of metals", IEEE Transaction on Sonics and Ultrasonics, Vol. 13, No.1 (1966), pp. 1-8.
14. Oliver, C., Pharr, G. M., "An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments", Journal of Materials Research, Vol. 7 (1992), pp. 1564-1583.