SCOPUS 정보 검색 플랫폼

Journal of Materials Science

Volumn 43, Issue 18, 2008, Pages 6038-6048

Detailed investigation of ultrasonic Al-Cu wire-bonds: II. Microstructural evolution during annealing

(4) Drozdov, M a Gur, G b Atzmon, Z b Kaplan, W D a

a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY (Israel)

b Kulicke and Soffa Bonding Tools (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; ARGON; COPPER; INERT GASES; ION BOMBARDMENT; MICROSCOPIC EXAMINATION; PHASE INTERFACES; WIRE;

BONDING PROCESSES; COMPOSITIONAL CHARACTERIZATION; COPPER WIRES; FOCUSED ION BEAM MILLING; INTERFACE COMPOSITION; INTERMETALLIC GRAINS; INTERMETALLIC PHASE; MICRO-STRUCTURAL; SCANNING AND TRANSMISSION ELECTRON MICROSCOPY; SITE-SPECIFIC; WIRE-BONDS;

ALUMINUM;

EID: 53349168425 PISSN: 00222461 EISSN: 15734803 Source Type: Journal
DOI: 10.1007/s10853-008-2955-9 Document Type: Article

Times cited : (54)

References (21)

1
- 0003717016
- McGraw-Hill New York
- Harman G (1997) Wire bonding in microelectronics materials, processes, reliability and yield. McGraw-Hill, New York
- (1997) Wire Bonding in Microelectronics Materials, Processes, Reliability and Yield
- Harman, G.¹

2
- 53349147056
- doi:10.1007/s10853-008-2954-x
- Drozdov M, Gur G, Atzmon Z, Kaplan WD (2008) J Mater Sci. doi: 10.1007/s10853-008-2954-x
- (2008) J Mater Sci.
- Drozdov, M.¹ Gur, G.² Atzmon, Z.³ Kaplan, W.D.⁴

3
- 0029329274
- 1-4. 10.1016/0304-3991(95)00020-2
- R Brydson J Bruley H Mullejans C Scheu M Ruhle 1995 Ultramicroscopy 59 1-4 81 10.1016/0304-3991(95)00020-2
- (1995) Ultramicroscopy , vol.59 , pp. 81
- Brydson, R.¹ Bruley, J.² Mullejans, H.³ Scheu, C.⁴ Ruhle, M.⁵

4
- 33748289953
- 16. 10.1007/s10853-006-0437-5
- H Sadan WD Kaplan 2006 J Mater Sci 41 16 5099 10.1007/s10853-006-0437-5
- (2006) J Mater Sci , vol.41 , pp. 5099
- Sadan, H.¹ Kaplan, W.D.²

5
- 0025560701
- 4. 10.1109/33.62577
- K Toyozawa K Fujita S Minamide T Maeda 1990 IEEE Trans Compon Hybr Manuf Technol 13 4 667 10.1109/33.62577
- (1990) IEEE Trans Compon Hybr Manuf Technol , vol.13 , pp. 667
- Toyozawa, K.¹ Fujita, K.² Minamide, S.³ Maeda, T.⁴

6
- 24644458736
- 1
- I Singh Sr JY On L Levine Sr 2005 Proc Electron Compon Technol 55 1 843
- (2005) Proc Electron Compon Technol , vol.55 , pp. 843
- Singh Sr, I.¹ On, J.Y.² Levine Sr, L.³

7
- 0036576093
- 5. 10.1023/A:1015580227090
- CW Tan AR Daud 2002 J Mater Sci Mater Electron 13 5 309 10.1023/A:1015580227090
- (2002) J Mater Sci Mater Electron , vol.13 , pp. 309
- Tan, C.W.¹ Daud, A.R.²

8
- 0141818972
- 1. 10.1016/S1044-5803(03)00102-5
- S Murali N Srikanth CJ Vath 2003 Mater Charact 50 1 39 10.1016/S1044-5803(03)00102-5
- (2003) Mater Charact , vol.50 , pp. 39
- Murali, S.¹ Srikanth, N.² Vath, C.J.³

9
- 28444440297
- Singapore, 8-10 December
- Wulff FW, Breach CD, Saraswati SD, Dittmer KJ (2004) Proceedings of electronics packaging technology confernce, Singapore, 8-10 December, p 348
- (2004) Proceedings of Electronics Packaging Technology Confernce , pp. 348
- Wulff, F.W.¹ Breach, C.D.² Saraswati, S.D.³ Dittmer, K.J.⁴

10
- 0023588461
- 4. 10.1109/TCHMT.1987.1134799
- J Onuki M Koizumi I Araki 1987 IEEE Trans Compon Hybr Manuf Technol 10 4 550 10.1109/TCHMT.1987.1134799
- (1987) IEEE Trans Compon Hybr Manuf Technol , vol.10 , pp. 550
- Onuki, J.¹ Koizumi, M.² Araki, I.³

11
- 33746228304
- 8. 10.1016/j.microrel.2005.11.002
- P Ratchev S Stoukatch B Swinnen 2006 Microelectron Reliab 46 8 1315 10.1016/j.microrel.2005.11.002
- (2006) Microelectron Reliab , vol.46 , pp. 1315
- Ratchev, P.¹ Stoukatch, S.² Swinnen, B.³

12
- 0042386689
- 2. 10.1109/TCAPT.2003.815121
- H-J Kim JY Lee K-W Paik 2003 IEEE Trans Compon Packag Tech 26 2 367 10.1109/TCAPT.2003.815121
- (2003) IEEE Trans Compon Packag Tech , vol.26 , pp. 367
- Kim, H.-J.¹ Lee, J.Y.² Paik, K.-W.³

13
- 33846786811
- 2. 10.1007/s10853-006-1148-7
- S Murali N Srikanth YM Wong CJ Vath 2007 J Mater Sci 42 2 615 10.1007/s10853-006-1148-7
- (2007) J Mater Sci , vol.42 , pp. 615
- Murali, S.¹ Srikanth, N.² Wong, Y.M.³ Vath, C.J.⁴

14
- 33947600574
- 7. 10.1007/s10853-007-1592-z
- A Karpel G Gur Z Atzmon WD Kaplan 2007 J Mater Sci 42 7 2334 10.1007/s10853-007-1592-z
- (2007) J Mater Sci , vol.42 , pp. 2334
- Karpel, A.¹ Gur, G.² Atzmon, Z.³ Kaplan, W.D.⁴

15
- 33947576030
- 7. 10.1007/s10853-007-1593-y
- A Karpel G Gur Z Atzmon WD Kaplan 2007 J Mater Sci 42 7 2347 10.1007/s10853-007-1593-y
- (2007) J Mater Sci , vol.42 , pp. 2347
- Karpel, A.¹ Gur, G.² Atzmon, Z.³ Kaplan, W.D.⁴

16
- 33750313673
- 3. 10.1115/1.2229214
- S Murali N Srikanth CJ Vath 2006 J Electron Packag 128 3 192 10.1115/1.2229214
- (2006) J Electron Packag , vol.128 , pp. 192
- Murali, S.¹ Srikanth, N.² Vath, C.J.³

17
- 51649125442
- doi:10.1016/j.matchar.2008.02.007
- Thangadurai P, Lumelsky Y, Silverstein MS, Kaplan WD (2008) Mater Charact. doi: 10.1016/j.matchar.2008.02.007
- (2008) Mater Charact.
- Thangadurai, P.¹ Lumelsky, Y.² Silverstein, M.S.³ Kaplan, W.D.⁴

18
- 0022205230
- 5
- JL Murray 1985 Int Met Rev 30 5 211
- (1985) Int Met Rev , vol.30 , pp. 211
- Murray, J.L.¹

19
- 0024737609
- 9. 10.1016/0001-6160(89)90040-0
- A Hill ER Wallach 1989 Acta Metall 37 9 2425 10.1016/0001-6160(89)90040-0
- (1989) Acta Metall , vol.37 , pp. 2425
- Hill, A.¹ Wallach, E.R.²

20
- 0027700881
- 11. 10.1016/0956-7151(93)90036-R
- Y Takahashi K Inoue K Nishiguchi 1993 Acta Metall Mater 41 11 3077 10.1016/0956-7151(93)90036-R
- (1993) Acta Metall Mater , vol.41 , pp. 3077
- Takahashi, Y.¹ Inoue, K.² Nishiguchi, K.³

21
- 0021468247
- 2. 10.1063/1.333960
- RA Hamm JM Vandenberg 1984 J Appl Phys 56 2 293 10.1063/1.333960
- (1984) J Appl Phys , vol.56 , pp. 293
- Hamm, R.A.¹ Vandenberg, J.M.²

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.