Effect of bonding temperature, post-bond annealing and extended range thermal cycling on the reliability of al wire bonds

International Conference and Exhibition on High Temperature Electronics 2008, HiTEC 2008

Volumn , Issue , 2008, Pages 40-47

  Loh, W S ^a   Agyakwa, P A ^b   Hogg, S C ^c   Ikujeniya, R J ^c   Corfield, M R ^a   Johnson, C M ^b  

^a UNIVERSITY OF SHEFFIELD   (United Kingdom)

^b UNIVERSITY OF NOTTINGHAM   (United Kingdom)

^c LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

Grain size; Heavy gauge aluminium wire; High temperature bonding; Reliability; Thermal cycling

Indexed keywords

ALUMINIUM WIRES; CYCLING TEMPERATURES; ELEVATED TEMPERATURE; GRAIN SIZE; HIGH TEMPERATURE; LOW TEMPERATURE PHASE; MICROSTRUCTURAL ANALYSIS; THERMAL CYCLING RELIABILITY;

ALUMINUM; ALUMINUM COATINGS; ANNEALING; BONDING; CRACKS; RELIABILITY; THERMAL CYCLING; WIRE;

REDUCTION;

EID: 84879874344     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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