메뉴 건너뛰기




Volumn , Issue , 2008, Pages 417-421

High temperature behaviour and reliability of Al-Ribbon for automotive applications

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; APPLICATIONS; AUTOMOBILE ELECTRONIC EQUIPMENT; AUTOMOBILE PARTS AND EQUIPMENT; AUTOMOTIVE INDUSTRY; DUCTILE FRACTURE; ELECTRIC BATTERIES; ELECTRIC POWER SYSTEMS; HIGH TEMPERATURE APPLICATIONS; INDUSTRIAL APPLICATIONS; LIGHT METALS; MECHANICAL PROPERTIES; POWER ELECTRONICS; RELIABILITY; SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 58149089072     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2008.4684384     Document Type: Conference Paper
Times cited : (12)

References (8)
  • 1
    • 84876563721 scopus 로고    scopus 로고
    • PowerRibbon™ - An Alternative Interconnect Technology for Small Power Packages
    • Luechinger, C., Oftebro, K. Haumann, S. "PowerRibbon™ - An Alternative Interconnect Technology for Small Power Packages ", IMAPS 2006
    • IMAPS 2006
    • Luechinger, C.1    Oftebro, K.2    Haumann, S.3
  • 2
    • 84941230047 scopus 로고    scopus 로고
    • Heavy Al Ribbon Interconnect: An Alternative Solution for Hybrid Power Packaging
    • Ong, B, Luechinger, C., "Heavy Al Ribbon Interconnect: An Alternative Solution for Hybrid Power Packaging", IMAPS 2004
    • IMAPS 2004
    • Ong, B.1    Luechinger, C.2
  • 3
    • 58149090695 scopus 로고    scopus 로고
    • Large Aluminum Ribbon Bonding: An Alternative Interconnect Solution for Power Module Applications
    • Luechinger, C., "Large Aluminum Ribbon Bonding: An Alternative Interconnect Solution for Power Module Applications", PCIM Europe Conference 2005
    • PCIM Europe Conference 2005
    • Luechinger, C.1
  • 4
    • 58149096022 scopus 로고    scopus 로고
    • Gilardoni, R.,Baendchenbonden statt Drahtbonden, PLUS, 11/2007
    • Gilardoni, R.,"Baendchenbonden statt Drahtbonden", PLUS, 11/2007
  • 5
    • 50049105458 scopus 로고    scopus 로고
    • Ribbon bonding - A scalable Interconnect for Power QFN Packages
    • Luechinger, C., "Ribbon bonding - A scalable Interconnect for Power QFN Packages" EPTC Singapore Conference 2007
    • EPTC Singapore Conference 2007
    • Luechinger, C.1
  • 7
    • 58149093756 scopus 로고    scopus 로고
    • CIGS solar modules contacted by conducted adhesives and ultrasonic welding
    • Barcelona
    • th EPSE Conference, Barcelona 2005
    • (2005) th EPSE Conference
    • Herz, K.1    at al2
  • 8
    • 70349664979 scopus 로고    scopus 로고
    • Further Characterisation of intermetallic Growth in Copper and Gold Ball Bonds on Aluminium Metallisation
    • Wulff, F. at al."Further Characterisation of intermetallic Growth in Copper and Gold Ball Bonds on Aluminium Metallisation" Semicon Singapore 2005
    • (2005) Semicon Singapore
    • Wulff, F.1    at al2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.