Thick Al ribbon interconnects: A feasible solution for power devices packaging

Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008

Volumn , Issue , 2008, Pages 1056-1063

  Loh, Wei Sun ^a   Agyakwa, Pearl A ^b   Johnson, C Mark ^b   Loh, Tick Kwang ^c   Luechinger, Christoph ^c   Oftebro, Kristian ^c  

^a UNIVERSITY OF SHEFFIELD   (United Kingdom)

^b UNIVERSITY OF NOTTINGHAM   (United Kingdom)

^c Orthodyne Electronics   (United States)

Author keywords

Aluminum; Bond parameters; Reliability; Ribbon bond; Thermal cycling

Indexed keywords

BOND PARAMETERS; ELECTRICAL PERFORMANCE; LONG-TERM STRENGTH; MICROSTRUCTURAL ANALYSIS; PERFORMANCE AND RELIABILITIES; POTENTIAL EFFECTS; RIBBON BOND; THERMAL CYCLING RELIABILITY;

DEFORMATION; MICROELECTRONICS; RELIABILITY; THERMAL CYCLING;

ALUMINUM;

EID: 84876907687     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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