Power device stacking using surface bump connections

Proceedings of the International Symposium on Power Semiconductor Devices and ICs

Volumn , Issue , 2009, Pages 204-207

  Castellazzi, A ^a   Mermet Guyennet, M ^b  

^a UNIVERSITY OF NOTTINGHAM   (United Kingdom)

^b ALSTOM   (France)

Author keywords

[No Author keywords available]

Indexed keywords

DOUBLE-SIDED COOLING; FREEWHEELING DIODES; HALF-BRIDGE; INTEGRATION APPROACH; POWER DEVICES; POWER SYSTEM DESIGNS; PROTOTYPE DEVELOPMENT; SURFACE BUMPS;

ELECTRIC EQUIPMENT; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR SWITCHES;

POWER ELECTRONICS;

EID: 77949948342     PISSN: 10636854     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISPSD.2009.5158037     Document Type: Conference Paper

References (8)

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