Fabrication of copper damascene patterns on polyimide using direct metallization on trench templates generated by imprint lithography

Langmuir

Volumn 26, Issue 14, 2010, Pages 12448-12454

  Matsumura, Yasufumi ^a   Enomoto, Yasushi ^a   Tsuruoka, Takaaki ^b   Akamatsu, Kensuke ^b   Nawafune, Hidemi ^b  

^a NIPPON STEEL CORPORATION   (Japan)

^b KONAN UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER DAMASCENE; COPPER FILMS; IMIDIZATION; IMPRINT LITHOGRAPHY; INSULATING SUBSTRATES; ION EXCHANGE REACTIONS; METALLIZATIONS; NICKEL FILM; POLISHING PROCESSS; POLY(AMIC ACID); POLYIMIDE SUBSTRATE; THIN LAYERS; WET CHEMICAL PROCESS;

COPPER; ELECTRODEPOSITION; ION EXCHANGE; METALLIC FILMS; NANOIMPRINT LITHOGRAPHY; POLYIMIDES; SURFACE STRUCTURE;

SUBSTRATES;

BAYSILON; BENZENE DERIVATIVE; COPPER; DIMETICONE; NICKEL; POLYAMIC ACID; POLYMER;

ARTICLE; CHEMISTRY; DIFFUSION; METHODOLOGY; MICROTECHNOLOGY; PRINTING;

BENZENE DERIVATIVES; COPPER; DIFFUSION; DIMETHYLPOLYSILOXANES; MICROTECHNOLOGY; NICKEL; POLYMERS; PRINTING;

EID: 77956694796     PISSN: 07437463     EISSN: 15205827     Source Type: Journal    
DOI: 10.1021/la101350f     Document Type: Article

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