Direct patterning of copper on polyimide using ion exchangeable surface templates generated by site-selective surface modification

Journal of the American Chemical Society

Volumn 126, Issue 35, 2004, Pages 10822-10823

  Akamatsu, Kensuke ^a   Ikeda, Shingo ^b   Nawafune, Hidemi ^a   Yanagimoto, Hiroshi ^b  

^a KONAN UNIVERSITY   (Japan)

^b Limited   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; POLYIMIDE;

ANALYTIC METHOD; AQUEOUS SOLUTION; ARTICLE; CHEMICAL ANALYSIS; CHEMICAL MODIFICATION; CONTROL SYSTEM; ION EXCHANGE; PATTERN RECOGNITION; PHOTOCHEMICAL QUENCHING; STRUCTURE ANALYSIS; SURFACE PROPERTY; ULTRAVIOLET RADIATION;

EID: 4444236725     PISSN: 00027863     EISSN: None     Source Type: Journal    
DOI: 10.1021/ja047700e     Document Type: Article

References (20)

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18. -2 by ICP measurements for films printed at 30 °C followed by standing for 5 min. This value corresponds to a modified layer thickness of ca. 3 μm. Note that in the present case, the printed solvents are gradually evaporated during standing (but not completely after 5 min), leading to an increase in potassium hydroxide concentration, which induces a gradual increase in hydrolysis rate. The contact time also affects the feature size; the solution can diffuse in the direction parallel to the polyimide surface. See Supporting Information for details.
19. Specific resistance (measured by a four-probe method) was 1.84 μΩ cm (bulk copper: 1.67 μΩ cm), which is suitable for USLI applications.
20. We have extended our method to the fabrication of Ag, Pt, Ni, In, and Sn circuit patterns using their respective metal salts, and the general behavior is similar to that of copper.