All-wet fabrication process for ULSI interconnect technologies

Electrochimica Acta

Volumn 51, Issue 5, 2005, Pages 916-920

  Yoshino, M ^a   Nonaka, Y ^a   Sasano, J ^a   Matsuda, I ^a   Shacham Diamand, Y ^a,b   Osaka, T ^a  

^a WASEDA UNIVERSITY   (Japan)

^b TEL AVIV UNIVERSITY   (Israel)

Author keywords

Cu; Electroless deposition; NiB; SAM; ULSI

Indexed keywords

ADHESION; ANNEALING; COPPER; DIFFUSION; ELECTRIC WIRING; ELECTROLESS PLATING; MICROPROCESSOR CHIPS; NICKEL ALLOYS; SECONDARY ION MASS SPECTROMETRY; SELF ASSEMBLY;

CU WIRING; NIB; SAM;

ULSI CIRCUITS;

EID: 27644438381     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2005.04.069     Document Type: Conference Paper

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